5 results about "Radiated field" patented technology

The present application relates to a kind of rail transit space electromagnetic radiation monitoring method and system based on radio frequency holography, comprising: obtaining three-dimensional surface boundary data and converting into spatial geometry coordinate matrix flow, receiving probe array collected signal extraction as amplitude aliasing radio frequency signal stream and executing time domain alignment calibration;Call coordinate matrix flow to signal stream mirror image unfolding synthesis virtual holographic antenna receiving data stream;Parse doppler frequency domain disturbance and construct mask level, evaluate channel conversion law and generate trigger token signal;Based on token signal, virtual data stream is screened and intercepted, and coherent holographic receiving flow data is obtained;Joint matrix flow is approximated in reverse to the intercepted data, and space holographic complex tensor is generated, and dynamic hologram is output after three-dimensional digital grid reconstruction.The present application solves the problem of how to reconstruct three-dimensional space electromagnetic radiation field in dynamically changing environment with multi-path reflection characteristics using non-coherent probe array with more simplified hardware structure.

This invention provides a method and apparatus for detecting electromagnetic compatibility radiated emissions from a vehicle, relating to the field of automotive electronics technology. The invention constructs a dynamic ground loop impedance excitation platform in an anechoic chamber, controls the on / off state of metal ground units through a digital ground plane array, generates various test conditions, and simultaneously acquires the vehicle's time-domain radiated field signal and ground loop common-mode current signal. Time-frequency analysis is performed on the signals to identify out-of-standard frequencies, calculates the rate of change of radiated field strength and ground loop impedance relative to the baseline conditions, and quantifies it as a fault sensitivity factor. Based on this, a high-dimensional fault feature fingerprint matrix is ​​constructed. This vector is matched with a pre-set fault mode database to diagnose the main fault source types. By analyzing the spatial dimensions sensitive to ground loop disturbances in the feature fingerprint, and combining this with the vehicle's electrical topology model, the installation location of the fault source is calculated. Finally, a structured report containing diagnostic results, location information, and rectification suggestions is automatically generated.

This invention discloses a far-field measurement system and method for the spatial radiation field of a mobile suspended conductor arc discharge, comprising: a mobile suspended conductor arc discharge device for controlling the arc discharge of the suspended conductor; a signal receiving module for receiving the broadband far-field electromagnetic radiation signal generated by the discharge and converting it into a radio frequency (RF) signal; a signal conditioning module for conditioning the RF signal; a signal analysis module for analyzing the RF signal using a spectrum analyzer and outputting data analysis results; a vector network analyzer for verifying the link matching status between modules; a calibration module for calibrating the device based on a standard reference signal; a data processing module for synthesizing the standard uncertainty based on the calibration data; and simultaneous measurement of four measurement traces: peak value detection, average value detection, sampled value detection, and root mean square (RMS) detection, and calculation of the electric field intensity distribution based on the four measurement traces. This achieves high-precision measurement of the far-field characteristics of the spatial radiation of the arc discharge.

The application discloses a multi-physical field coupling chip package reliability accelerated test and life prediction method, which comprises the following steps: first, a temperature cycle-vibration-humidity-power cycle-thermal shock-electromagnetic radiation field five-dimensional integrated stress test environment is constructed, and each stress parameter is accurately set and applied according to the actual working condition; then, a five-dimensional accelerated test model is established by weighting and fusing each single stress acceleration model, and the weight coefficient is determined based on the actual working condition influence weight; subsequently, finite element simulation is adopted to analyze the stress, heat conduction and electromagnetic coupling effect of the packaging structure, and the acceleration factor is corrected in real time by combining the physical failure (PoF) algorithm; finally, a packaging level life digital image containing failure modes and failure time distribution is constructed based on multi-dimensional data, and reliability test and life prediction are realized. The test time is less than or equal to 200 hours, the life prediction accuracy is greater than or equal to 90%, and the method is suitable for mainstream packaging types such as BGA, CSP, SiP and FlipChip, thereby providing an efficient solution for chip package reliability evaluation.

This application provides a common-aperture antenna and electronic device. The common-aperture antenna includes multiple radiating patches and horizontally polarized feed lines. The horizontally polarized feed lines include a first horizontally polarized feed line and a second horizontally polarized feed line. At least one first shared patch is included among the multiple radiating patches. The first and second horizontally polarized feed lines excite the same first shared patch to generate orthogonal radiating polarizations. By making the radiating polarizations generated by the first and second horizontally polarized feed lines exciting the same first shared patch orthogonal, two radiating fields can coexist on the same patch without coupling, achieving self-decoupling. Furthermore, the first shared patch can be reused in different radiating arrays, significantly improving aperture utilization, forming a common-aperture antenna, and reducing antenna complexity and size.