Acrylic copolymer and radiation-sensitive resin composition

A technology of resin composition and acrylic, which is applied in optics, instruments, optomechanical equipment, etc. It can solve the problems of poor resolution, no thermal deformation technology, etc., and achieve the effect of reducing line width variation and high dry spots on the surface

Inactive Publication Date: 2007-09-12
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in order to form a contact hole with a narrower aperture, although the thermal deformation technology of reducing the size of the contact hole pattern by post-baking after development can be used, when using ArF excimer laser (wavelength 193nm), F 2 Radiation-sensitive resin compositions used for excimer lasers (wavelength 157nm) below about 200nm have the problem that there is no radiation-sensitive resin suitable for thermal deformation technology
In particular, when the contact hole becomes narrower and the line spacing becomes narrower, the presence of dry spots during fine etching adversely affects the resolution

Method used

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  • Acrylic copolymer and radiation-sensitive resin composition
  • Acrylic copolymer and radiation-sensitive resin composition
  • Acrylic copolymer and radiation-sensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0107]

[0108] Prepare to dissolve 55.00 g (50 mol %) of compound (4-1), 11.70 g (10 mol %) of compound (4-2), and 33.31 g (40 mol %) of compound (4-3) in 200 g of 2-butanone 4.56 g of dimethyl azobisisobutyrate was added to the monomer solution, and a 1000 ml three-necked flask into which 100 g of 2-butanone had been added was purged with nitrogen for 30 minutes. After nitrogen purging, the reactor was heated to 80° C. while stirring, and the above-mentioned monomer solution prepared in advance was added dropwise over 4 hours using a dropping funnel. The start of the dropwise addition was regarded as the start time of the polymerization, and the polymerization reaction was carried out for 6 hours. After the polymerization is completed, the polymerization solution is cooled to below 30° C. by water cooling, poured into 2000 g of a mixed solvent of 2-propanol / n-heptane=1 / 2, and the precipitated white powder is filtered. The filtered white powder was washed twice on the slu...

Embodiment 2

[0110]

[0111] Prepare to dissolve 54.57g (50 mol%) of compound (5-1), 12.39g (10 mol%) of compound (5-2) and 33.04g (40 mol%) of compound (5-3) in 200g of 2-butanone 4.52 g of dimethyl azobisisobutyrate was added into the monomer solution, and a 1000 ml three-neck flask into which 100 g of 2-butanone had been added was purged with nitrogen for 30 minutes. After nitrogen purging, the reactor was heated to 80° C. while stirring, and the above-mentioned monomer solution prepared in advance was added dropwise over 4 hours using a dropping funnel. The start of the dropwise addition was regarded as the start time of the polymerization, and the polymerization reaction was carried out for 6 hours. After the polymerization is completed, the polymerization solution is cooled to below 30° C. by water cooling, put into 2000 g of a mixed solvent of 2-propanol / n-heptane=1 / 2, and the precipitated white powder is filtered. Use the mixed solvent 400g of 2-propanol / n-heptane=1 / 2 to wash t...

Embodiment 3

[0113]

[0114] Prepare to dissolve 55.38g (50 mol%) of compound (6-1), 11.08g (10 mol%) of compound (6-2) and 33.54g (40 mol%) of compound (6-3) in 200g of 2-butanone 4.59 g of dimethyl azobisisobutyrate was added into the monomer solution, and a 1000 ml three-necked flask into which 100 g of 2-butanone had been added was purged with nitrogen for 30 minutes. After nitrogen purging, the reactor was heated to 80° C. while stirring, and the above-mentioned monomer solution prepared in advance was added dropwise over 4 hours using a titration funnel. The start of the dropwise addition was regarded as the start time of the polymerization, and the polymerization reaction was carried out for 6 hours. After the polymerization is completed, the polymerization solution is cooled to below 30° C. by water cooling, poured into 2000 g of a mixed solvent of 2-propanol / n-heptane=1 / 2, and the precipitated white powder is filtered. Use the mixed solvent 400g of 2-propanol / n-heptane=1 / 2 to ...

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Abstract

An acrylic copolymer having a specific structure; and a composition containing the copolymer. The composition is highly transparent to radiations and is excellent in basic properties required of resists, such as sensitivity, resolution, resistance to dry etching, and pattern shape. It is highly suitable especially for use as a resist for forming contact holes and line spaces.

Description

technical field [0001] The present invention relates to an acrylic copolymer and a radiation-sensitive resin composition. In particular, it relates to X-rays, synchrotron radiation, and the like that can be suitably used for far-ultraviolet rays such as KrF excimer lasers or ArF excimer lasers, etc. Radiation-sensitive resin composition used for chemically amplified resists for various radiation microfabrication such as charged particle beams such as electron beams. Background technique [0002] In the field of microfabrication represented by the manufacture of integrated circuit devices, ArF excimer lasers (wavelength 193nm), F 2 Excimer laser (wavelength 157nm) is a photolithography technology that can be microfabricated to a level below 200nm. As radiation-sensitive resin compositions suitable for irradiation with such excimer laser light, there are provided many acid generators that use components having acid-dissociative functional groups, and components that generate ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/10G03F7/039
Inventor 石井宽之藤原考一山口宙志西村幸生
Owner JSR CORPORATIOON
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