Porous structive coramic cooling fin and its making method
A technology of ceramic heat sink and heat sink, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of poor heat conduction and heat dissipation, and solve the problems of poor heat dissipation, simple production process, and low raw material cost. low effect
Inactive Publication Date: 2008-05-28
ABC TAIWAN ELECTRONICS CORP
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Problems solved by technology
Although the existing heat sinks have been made of copper and aluminum alloys with good heat conduction and heat dissipation effects, there is still room for improvement because the heat conduction and heat dissipation effects are not the best.
Method used
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[0042] A ceramic heat sink with a porous structure, including a heat dissipation layer 1, a heat conduction layer 2 and a fan, the heat conduction layer 2 is covered on the contact surface between the heat dissipation layer and a heat source, the fan is fixed on one side of the heat sink, and the heat dissipation layer 1 is made of latex-like slurry It is mixed with a ceramic material to form a hollow crystalline porous structure with a porosity of 20%. The heat dissipation layer with a porous structure has a porosity of 5-40% and a particle size of the ceramic material of 0.20 μm.
[0043] Wherein, the latex slurry includes an organic solvent, a dispersant and a polymer binder. The organic solvent is ethanol and toluene, the polymer binder is polyvinyl alcohol, and the ceramic material is a mixture of titanium dioxide, barium oxide, strontium oxide, aluminum oxide and zirconium oxide. The consumption of ethanol is 18% of the ceramic material; the consumption of toluene is 26%...
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Abstract
The thermal fin is composed of heat emission layer, heat-conducting layer and fan. Based on principle of microcosmic chemical liquid phase change, uneven dispersing pulp in emulsion state forms tiny wrap structure of ceramics powder. Heat emission layer possessing pore space structure containing hollow crystal is obtained by sintering the combination of the said tiny wrap structure of ceramics powder and powder in submicro. A heat-conducting layer is setup at heat emission layer being contacted to heat source. The heat-conducting layer absorbs quantity of heat from heat source. Heat dispersion is carried out by pore space structure in hollow crystals of the heat emission layer through forced convection effect of fan. The invented thermal fin possesses features of large area of contacting air, high mechanical strength, good thermal diffusivity, low cost of material. The product can be applied to eliminating heat of IC chips and thermogenic electronic equipment.
Description
technical field [0001] The invention relates to a heat sink and a preparation method thereof, in particular to a ceramic heat sink with a porous structure and a preparation method thereof. Background technique [0002] With the development of digital processing equipment, the frequency of semiconductor components is increasing day by day, and the processing speed of digital chips represented by the central processing unit (CPU) is changing with each passing day. However, the high processing speed will also bring high temperature to the device. How to effectively discharge the heat generated by the electronic device so that it can operate at a suitable working temperature has become the focus of development by various companies. [0003] Taking computers as an example, existing central processing units are equipped with heat sinks to help discharge the heat generated by chips. Most of the radiators are equipped with heat sinks, and the heat sinks are fins of various shapes, ...
Claims
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IPC IPC(8): H01L23/373
Inventor 许智伟
Owner ABC TAIWAN ELECTRONICS CORP