Micro-thin pen for direct writing electronical photoelectronic component and its constituting device

Abstract

The invention discloses a mini pen of direct-writing electronic / photoelectronic component and its structure. The decompression device is located in the cap of the pen and connected with the pressing pipe on the top of the cap. The lower end of the cap is connected airtightly and movably with the upper end of the brush stand to form the bunker used to deposit the material that needs to deposit. The lower end of the brush stand is penpoint. The mini pen links with the air supply by two shunt-wound press controlling devices. The controller controls two gas paths and the relative movement of the mini pen to the base to form the direct-writing device. The mini pen can be used to create the electronic component and the photoelectronic component, for example, the polymer filter waveguide. Depending on the structure and polymer character of the mini pen, the polymer material can be put into the mini pen and direct write the filter waveguide. The wiring speed is rapid; the span of the wire width is large; the cost of producing and operating is low. The wiring speed is between 2 and 15mm / s and the wire width is between 0.06 and 2mm.

Description

technical field

[0001] The invention belongs to the field of electronic / optoelectronic components manufacturing, and in particular relates to a micropen for directly writing electronic / optoelectronic components and a device composed of the same. The invention is especially suitable for rapidly manufacturing wires, resistors, capacitors, inductors and optical waveguides. Background technique

[0002] The emergence and development of large-scale integrated circuits have greatly increased the circuit density, and continue to develop in the direction of high precision, high density, thin lines, small holes, high reliability, low cost, and automated continuous production. Especially in recent years, with the continuous development of electronic products in the direction of integration, miniaturization, short timeliness, small batches, and multiple varieties, the factors that restrict the further improvement of the quality of electronic products have changed from the original chip...

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