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Operation method of non-volatile memory unit array

A non-volatile storage and storage unit technology, applied in the field of non-volatile storage unit arrays, can solve the problems of reduced reliability of electronic devices, reduced device size, low programming efficiency, etc.

Inactive Publication Date: 2008-11-26
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the voltage used increases, the reliability of the electronic device will be reduced due to the high leakage current and low programming efficiency caused by the punch-through effect, especially when the memory device The smaller the size, the more severe the high leakage current and low programming efficiency caused by the punch-through effect, which will limit the degree of device size reduction

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  • Operation method of non-volatile memory unit array
  • Operation method of non-volatile memory unit array
  • Operation method of non-volatile memory unit array

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Embodiment Construction

[0034] figure 1 A schematic circuit diagram of a non-volatile memory cell array is shown. Wherein, the non-volatile memory cell array is a NAND (NAND gate) array. However, the operation method of the non-volatile memory cell array of the present invention is suitable for NAND (NAND gate) type array. In this embodiment, 4 columns of NAND column memory cells are taken as an example for illustration.

[0035] Please refer to figure 1 , the nonvolatile memory cell array includes a plurality of select transistors STa1 - STd1 and STa2 - STd2 , a plurality of memory cells Qa1 - Qdn, a plurality of word lines WL1 - WLn, and select gate lines SG1 and SG2 . The upper bit lines BLU1-BLU4 and the lower bit lines BLD1-BLD4.

[0036]The memory cells Qa1 to Qan form memory cell columns in the column direction, and are connected in series between the selection transistor STa1 and the selection transistor STa2 . The memory cells Qb1 to Qbn form memory cell columns in the column direction,...

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Abstract

The invention provides a nonvolatile storage cell array operating method, applied to operating NAND storage cell array, where each storage cell has a charge immersing layer. When operating the array, it uses F-N tunneling effect to erase the whole storage cell array and uses thermal electric hole-injecting effect to code a single bit in a single storage cell. With the F-N tunneling effect, its electron injecting efficiency is high, thus able to reduce the current of the storage cell when erasing and at the same time enhance operating speed. Moreover, the current consumption is low, able to effectively reduce the power loss of the whole chip.

Description

technical field [0001] The present invention relates to a method for operating a non-volatile memory cell array (Non-Volatile Memory Array), and in particular to a single memory cell two-bit (1 Cell 2 Bits) storage electrically erasable and Operation method of programming read-only memory (Electrically Erasable Programmable Read Only Memory, EEPROM) array. Background technique [0002] The electrically erasable and programmable read-only memory in the non-volatile memory has the advantages of multiple data storage, reading, erasing, etc., and the stored data will not disappear after power off , so it has become a memory device widely used in personal computers and electronic equipment. [0003] A typical electrically erasable and programmable read-only memory uses doped polysilicon to make a floating gate (Floating Gate) and a control gate (Control Gate). When the memory is programmed, the electrons injected into the floating gate are uniformly distributed throughout the p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C16/02H01L27/115H10B69/00
Inventor 叶致锴蔡文哲卢道政
Owner MACRONIX INT CO LTD
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