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Cleaning sheet and delivery material product with cleaning capability, method for cleaning substrate processing apparatus and the cleaned substrate processing apparatus

A substrate processing device and cleaning capability technology, applied in the field of cleaning sheets, can solve problems such as reducing operating efficiency

Inactive Publication Date: 2009-09-30
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods eliminate the need to suspend substrate handling equipment operations for cleaning, so there is no reduction in operational efficiency or additional labor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] 100 parts of acrylic (ester) polymer (weight average molecular weight: 700,000), 200 parts of polyethylene Diol 200 dimethacrylate (trade name: NK Ester 4G, manufactured by Shin-nakamura Chemical Corporation), 3 parts of polyisocyanate compound (trade name: "Colonate L", manufactured by NIPPON POLYURETHANE INDUSTRY CO., LTD. ) and 3 parts of benzyl dimethyl ketal (trade name: Irgacure 651, manufactured by Ciba Specialty Chemicals Inc.) as a photopolymerization initiator to prepare an ultraviolet-curable resin composition A.

[0063] Separately, in a 500 ml three-necked flask-type reactor equipped with a thermometer, a stirrer, a nitrogen inlet tube and a reflux condenser, 73 parts of 2-ethylhexyl acrylate, 10 parts of n-butyl acrylate, 15 parts of N,N - Dimethacrylamide, 5 parts of acrylic acid and 0.15 parts of 2,2'-azobisisobutyronitrile and 100 parts of ethyl acetate as polymerization initiators to obtain 200 g. Then, nitrogen gas was introduced into the reactor, an...

Embodiment 2

[0080] Resin composition A and pressure-sensitive adhesive solution A were prepared in the same manner as in Example 1.

[0081] The pressure-sensitive adhesive solution A described above was spread on the release-treated surface of a spacer made of a continuous length of polyester film (thickness: 38 microns; width: 250 mm) and then dried. The ester film was treated with a silicone-based release agent on one side to a dry thickness of 15 microns. Then, a continuous length of polyester film (thickness: 25 μm; width: 250 mm) was laminated as a support material on the adhesive layer thus prepared. The above-mentioned ultraviolet-curable resin composition A was then spread on the film to a thickness of 40 micrometers to provide a resin layer. Then, the surface of the resin layer was laminated with a protective film A made of a polyester film (one side of which had been treated with a silicone-based release agent) in such a way that the protective film A was peeled off. The surf...

Embodiment 3

[0119] Resin composition A and pressure-sensitive adhesive solution A were prepared in the same manner as in Example 1.

[0120] The above-mentioned pressure-sensitive adhesive solution A was spread on the release-treated surface of a spacer B made of a continuous length of polyester film (thickness: 38 μm; width: 250 mm), and then dried. The polyester film was treated with a silicone-based release agent on one side to a dry thickness of 15 microns. Then, a continuous length of polyester film (thickness: 25 μm; width: 250 mm) was laminated as a support material on the adhesive layer thus prepared. The above-mentioned ultraviolet-curable resin composition A was then spread on the film to a thickness of 40 micrometers to provide a resin layer. Then, the surface of the resin layer was laminated with the same spacer B used thereon in such a way that the release-treated surface of the spacer B was in contact with the resin layer to form a laminated sheet.

[0121] Then, use ultra...

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Abstract

The invention discloses a cleaning element, which does not contaminate a substrate processing device with ion impurities during the process of removing foreign matter inside the device by transporting the cleaning element into the device. The present invention also discloses a cleaning element, which does not pollute the substrate processing device by metal impurities during the process of removing foreign matter inside the device by transporting the cleaning element into the device. Specifically, a cleaning sheet is disclosed, which is characterized in that F-, Cl-, Br-, NO2-, NO3-, PO43-, SO42-, Na+, NH4+ and The pure water extraction amount of K+ was all 20 ppm or less (extracted at 120° C. boiling for 1 hour), and had an adhesive layer on the other surface of the support. The invention also discloses a cleaning sheet, which is characterized in that Na, K, Ca, Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu and Zn or their compounds are provided on one surface of the support. A cleaning layer was provided in an amount of 5 ppm (μg / g) each in terms of the respective metal elements, and an adhesive layer was provided on the other side.

Description

technical field [0001] The present invention relates to a cleaning sheet for various substrate processing devices susceptible to foreign substances, such as devices for manufacturing or testing semiconductors, flat panel displays, and printed circuit boards, and a method of cleaning substrate processing devices using the sheet , and a substrate processing device cleaned by the cleaning method. Background technique [0002] In various substrate processing apparatuses, various conveying systems and substrates are conveyed in physical contact with each other. In this process, when foreign matter is attached to the substrate or the delivery system, then the substrate is subsequently contaminated in turn. This makes it necessary to periodically stop the operation of the device for cleaning, making the operation less efficient or requiring more labor. [0003] In order to solve these problems, a method including conveying a substrate on which an adhesive material is fixed, by cl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B1/00H01L21/304G02F1/13H01L21/68C11D17/04H01L21/677
Inventor 寺田好夫并河亮丰田英志
Owner NITTO DENKO CORP
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