Hole-sealing technology in producing thermal CTP plate material
A plate material and hole sealing technology, which is applied in the printing process, printing plate, printing surface preparation, etc., can solve the problems of plate material corrosion resistance, poor pollution resistance, difficult to guarantee the sealing effect, and unsuitable for industrial production. Achieve the effects of easy operation, reasonable and standardized sealing process, and guaranteed sealing quality
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example 1
[0008] Example 1: Prepare Potassium Zirconium Fluoride Solution, the concentration is 15% (weight), the pH value is 5.0, add cyclohexane-hexacarboxylic acid and lithium dodecyl sulfate in an amount of 2.0g / L, and heat to 45°C , dip the aluminum plate for 25 seconds, take it out and spray it with hot water at 70°C.
example 2
[0009] Example 2: preparation potassium zirconium fluoride solution, concentration is 20% (weight), pH value is 4.5, adds polyphosphine group carboxylic acid and lauryl sulfate lithium in the amount of 2.5g / L, is heated to 50 ℃, will Dip the aluminum plate for 25 seconds, and spray it with 80°C hot water after taking it out.
example 3
[0010] Example 3: Prepare Potassium Zirconium Fluoride solution with a concentration of 20% (weight), pH value of 4.2, heat to 55°C, dip the aluminum plate for 30 seconds, take it out and spray it with 75°C hot water.
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