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Conductive inks and manufacturing method thereof

A conductive ink, conductor technology, applied in conductive coatings, conductive layers on insulating carriers, inks, etc., can solve problems such as slow decomposition, limitation of silver compounds, lack of stability and solubility, etc.

Active Publication Date: 2007-08-01
INKTEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, compounds derived from silver are limited and lack stability and solubility
In addition, they have a decomposition temperature of 200°C or higher, which is too high to obtain metal patterns with excellent conductivity, and decompose slowly

Method used

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  • Conductive inks and manufacturing method thereof
  • Conductive inks and manufacturing method thereof
  • Conductive inks and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] In a 50 mL Schlenk flask with a stirrer, 9.52 g (31.48 mmol) of 2-ethylhexylammonium 2-ethylhexylcarbamate (viscous liquid) was dissolved in a mixed solution containing 10.00 mL of methanol and 3.00 mL of an aqueous solution. Then, 1.00 g (15.74 mmol) of copper powder (Aldrich, particle size = 1 to 5 microns) was added and oxygen was bubbled to react for 30 minutes at room temperature. As the reaction progressed, the reaction mixture turned into a dark brown slurry and eventually a blue transparent solution. The solvent in the reaction solution was removed under vacuum to obtain 7.15 g of blue copper complex. Thermogravimetric analysis (TGA) confirmed that the copper content was 11.28% by weight. To 3.00g of the copper complex was added 5.00g copper scraps (TSC-20F, ChangSung), 0.20g binder polyvinyl butyral (BS-18, Wacker). After stirring for 10 minutes, the mixture was passed through a three-roll mill (Drais Mannheim) 5 times to obtain a conductive ink composition with a ...

Embodiment 2

[0066] In a 50mL Schlenk flask with a stirrer, 6.99g (31.48mmol) of 3-methoxypropylammonium 3-methoxypropylcarbamate (viscous liquid) was dissolved in 2.00g containing 5.00mL methanol and 50% by weight. Hydrogen oxide (H 2 O 2 ) In a mixed solution of aqueous solutions. Then, 1.00 g (15.74 mmol) of metallic copper was added and reacted at room temperature for 2 hours. As the reaction progressed, the reaction mixture became a brown slurry and eventually a blue transparent solution. The solvent in the reaction solution was removed under vacuum to obtain 5.58 g of blue copper complex. Thermogravimetric analysis (TGA) confirmed that the copper content was 16.26% by weight. Dissolve 1.00 g of copper complex by adding 1.00 g of methanol. Then a mixture of 1:1 (molar ratio) of 2-ethylhexylammonium 2-ethylhexylcarbamate and 2-methoxyethylammonium 2-methoxyethylcarbamate was mixed with silver oxide (silver content = 22.00 (Wt%) reacted to obtain 8.00 g of the complex, thereby obtaining a t...

Embodiment 3

[0068] In a 50 mL Schlenk flask with a stirrer, 7.53 g (41.88 mmol) of di(isopropylammonium carbonate) was dissolved in 1.89 g of a mixed solution containing 20.00 mL of methanol and 50% by weight of hydrogen peroxide (H2O2) aqueous solution. Then, 1.00 g (6.98 mmol) of copper (I) oxide was added and reacted at room temperature for 2 hours. As the reaction progressed, the reaction mixture became a brown slurry and eventually a blue transparent solution. The solvent in the reaction solution was removed under vacuum to obtain 6.28 g of blue copper complex. Thermogravimetric analysis (TGA) confirmed that the copper content was 14.17% by weight. 3.00g of the copper complex was added to 2.80g of a transparent butyl cellosolve solution, and 4.00g of silver chips (EA0295, Chemet) and 0.20g of binder polyvinyl butadiene were dissolved in the butyl cellosolve solution Aldehyde (Wacker). After stirring for 10 minutes, the solution was passed through a three-roll mill 5 times to obtain a con...

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Abstract

The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.

Description

Technical field [0001] The present invention relates to a conductive ink composition containing a metal complex with a specific structure and additives and a preparation method thereof. Background technique [0002] Recently, conductive ink is gradually attracting attention because it can be used in the formation of metal films or patterns and in lead-free (Pb) electrical / electronic circuits, low-resistance metal circuits, printed circuit boards (PCB), flexible printed circuit boards (FPC) ), antennas for radio frequency identification (RFID) tags, electromagnetic interference (EMI) shielding, plasma displays (PDP), liquid crystal displays (TFT-LCD), organic light emitting diodes (OLED), flexible displays, and organic thin film transistors (OTFT) Electrode printing in other fields. [0003] Japanese Patent Laid-Open No. 2004-221006 (August 5, 2004) and Japanese Patent Laid-Open No. 2004-273205 (September 30, 2004) disclose conductive inks that use a binder resin Or the solvent is...

Claims

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Application Information

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IPC IPC(8): C09D5/24C09D11/00C09D11/03C09D11/52H01B1/20H01B5/14
CPCC09D11/36C09D11/38C09D11/52H01B1/22
Inventor 郑光春赵显南孔明宣韩利燮朴正滨南东宪严圣镕徐永官赵南富
Owner INKTEC CO LTD
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