Preparation method of piezoelectric ceramic/epoxy resin composite

Abstract

This invention relates to preparation method of a kind of piezoelectric ceramics / ethoxyline resin composite material. It first shatter and grind solid ethoxyline resin, solid epoxy resin curing agent, piezoelectric ceramics go as far as 5 to 100 mu m particle size, misce bene according to mixture ratio, then add adhesive agent, quench to flake by sheeter; flake takes thermal insulation 1 to 2 hours under resin system curing temperature, then natural cooling to room temperature, through polish / spread electrode / polarize, then takes thermal insulation 1 to 10 hours under resin system postcure temperature, another time polarize, then gain piezoelectric ceramics / ethoxyline resin composite material.

Description

technical field [0001] The invention belongs to the field of piezoelectric ceramic / polymer composite material, and in particular relates to a preparation method of piezoelectric ceramic / epoxy resin composite material. Background technique [0002] Piezoelectric ceramics / polymer composites are an important new class of materials. In 1978, the Materials Laboratory of Pennsylvania State University in the United States first proposed the concept of piezoelectric ceramics / polymer composites. In recent years, no matter in its theoretical research, or its performance research, preparation process and application development, many significant achievements have been made. For example, it has extensive research and application in dielectric materials, damping materials, sensing and control, underwater acoustic materials, pyroelectric materials, etc. [0003] The piezoelectric ceramic / epoxy resin composite materials reported in the literature mainly use liquid epoxy resin as the matri...

AI Technical Summary

Problems solved by technology

There are several deficiencies in the preparation process of composite materials prepared by using liquid epoxy resin: (1) The viscosity of the system increases rapidly after piezoelectric ceramics are added to epoxy resin, and piezoelectric ceramic powder, epoxy resin and The curing agent is not easy to mix evenly, which will inevitably lead to the instability of the material and performance; (2) the gas stirred in during the mixing process is not easy to escape, and a large number of pores will be formed after curing, which will affect the performance of the material; (3) by adding solvent to dilute Piezoelectric ceramic / epoxy resin system, and then the solvent is evaporated. During the solvent evaporation process, due to the large difference in density between piezoelectric ceramics and epoxy resin, the piezoelectric ceramic particles will inevitably cause the piezoelectric ceramic particles to be in the liquid epoxy resin to a certain extent. (4) After the epoxy resin is completely cured, a dense rigid three-dimensional network structure is formed, and it is difficult for the dipole to turn to polarization during the polarization process, resulting in piezoelectric ceramic / epoxy Resin composites are more difficult to polarize

However, the piezoelectric ceramics, solid epoxy resin and epoxy resin solid curing agent are ground into powders and then pressed into powder, and then solidified to prepare piezoelectric ceramics / epoxy resin composites.

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