Preparation method of piezoelectric ceramic/epoxy resin composite

A technology of piezoelectric ceramics and epoxy resin, which is applied in the field of preparation of piezoelectric ceramics/epoxy resin composite materials, can solve problems affecting material performance, unstable materials and performance, and difficult gas escape, and achieve high-voltage electric Constant, stable performance, good matching effect

Inactive Publication Date: 2007-10-03
WUHAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There are several deficiencies in the preparation process of composite materials prepared by using liquid epoxy resin: (1) The viscosity of the system increases rapidly after piezoelectric ceramics are added to epoxy resin, and piezoelectric ceramic powder, epoxy resin and The curing agent is not easy to mix evenly, which will inevitably lead to the instability of the material and performance; (2) the gas stirred in during the mixing process is not easy to escape, and a large number of pores will be formed after curing, which will affect the performance of the material; (3) by adding solvent to dilute Piezoelectric ceramic/epoxy resin system, and then the solvent is evaporated. During the solvent evaporation process, due to t

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  • Preparation method of piezoelectric ceramic/epoxy resin composite

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Effect test

Embodiment 1

[0023] As shown in Figure 1, grind solid epoxy resin CYD017, solid epoxy resin curing agent phthalic anhydride, and piezoelectric ceramic PMN to 10-50 μm respectively, according to the ratio of CYD017: phthalic anhydride: PMN 1: 0.15: 5 parts by mass and mix evenly, then add polyvinyl alcohol adhesive accounting for 0.5% of the total weight of CYD017, phthalic anhydride and PMN, press it into a thin sheet under 30MPa pressure, and place it in an electric heater at 130°C Incubate in a constant temperature drying oven for 1 h and then cool to room temperature. Polish the slice, cover it with silver, polarize it at 100°C and 8KV for 20min, then keep it at 150°C for 2h, and then conduct the second polarization to prepare the piezoelectric ceramic / epoxy resin composite material. The piezoelectric voltage constant of the composite material is 16pC / N.

Embodiment 2

[0025] Grind solid epoxy resin, solid epoxy resin curing agent diaminodiphenylmethane, and piezoelectric ceramic PZT to 60-80 μm respectively, according to solid epoxy resin D.E.R.692: diaminodiphenylmethane: piezoelectric ceramic PZT The mass and number ratio is 1:0.30:10, mix evenly, then add PVA adhesive accounting for 1.5% of the total weight of solid epoxy resin D.E.R.692, diaminodiphenylmethane and piezoelectric ceramic PZT, and press under 50MPa pressure to form Thin slices were placed in an electric constant temperature drying oven at 90°C for 1 hour and then cooled to room temperature. Polish the slice, cover it with silver, polarize it at 80°C and 6KV for 15 minutes, then keep it at 120°C for 3 hours, and then conduct the second polarization to prepare the piezoelectric ceramic / epoxy resin composite material. The piezoelectric voltage constant of the composite material is 23pC / N.

Embodiment 3

[0027] As shown in Figure 1, a kind of preparation method of piezoelectric ceramic / epoxy resin composite material, it comprises the steps:

[0028] 1). The solid epoxy resin and the solid epoxy resin curing agent are pulverized and ground to a particle size of 5 μm respectively, and then mixed evenly in parts by mass of solid epoxy resin: solid epoxy resin curing agent=1: 0.08, Obtain an epoxy resin system for subsequent use; the solid epoxy resin is CYD019, and the epoxy resin curing agent is phthalic anhydride.

[0029] 2). Grinding and ball milling the piezoelectric ceramic sheet to a particle size of 5 μm to obtain the piezoelectric ceramic powder; the epoxy resin system and the piezoelectric ceramic are selected according to the mass-number ratio of the epoxy resin system and the piezoelectric ceramic powder at 1:3 Piezoelectric ceramic powder is added to the epoxy resin system and mixed evenly to obtain piezoelectric ceramic / epoxy resin powder; the piezoelectric ceramic ...

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Abstract

This invention relates to preparation method of a kind of piezoelectric ceramics /ethoxyline resin composite material. It first shatter and grind solid ethoxyline resin, solid epoxy resin curing agent, piezoelectric ceramics go as far as 5 to 100 mu m particle size, misce bene according to mixture ratio, then add adhesive agent, quench to flake by sheeter; flake takes thermal insulation 1 to 2 hours under resin system curing temperature, then natural cooling to room temperature, through polish/ spread electrode/ polarize, then takes thermal insulation 1 to 10 hours under resin system postcure temperature, another time polarize, then gain piezoelectric ceramics / ethoxyline resin composite material.

Description

technical field [0001] The invention belongs to the field of piezoelectric ceramic / polymer composite material, and in particular relates to a preparation method of piezoelectric ceramic / epoxy resin composite material. Background technique [0002] Piezoelectric ceramics / polymer composites are an important new class of materials. In 1978, the Materials Laboratory of Pennsylvania State University in the United States first proposed the concept of piezoelectric ceramics / polymer composites. In recent years, no matter in its theoretical research, or its performance research, preparation process and application development, many significant achievements have been made. For example, it has extensive research and application in dielectric materials, damping materials, sensing and control, underwater acoustic materials, pyroelectric materials, etc. [0003] The piezoelectric ceramic / epoxy resin composite materials reported in the literature mainly use liquid epoxy resin as the matri...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/24B29C70/88
Inventor 黄志雄石敏先何慧敏秦岩王雁冰杨国瑞郦亚铭魏涛
Owner WUHAN UNIV OF TECH
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