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Photocuarable resin composition

A technology of photocurable resin and composition, which is applied in the direction of photosensitive materials used in optomechanical equipment, etc., and can solve problems such as damage to physical properties

Inactive Publication Date: 2007-10-24
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these epoxy resin compositions have high moisture permeability, which may lead to impairment of physical properties, and it is still necessary to improve thermal conductivity and adhesive strength

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-8

[0014] [Examples 1-8 and Comparative Examples]

[0015] The photocurable resin compositions of Examples 1-8 and Comparative Examples were prepared according to the components and ratios shown in Table 1. First, a cationic photopolymerization initiator, a coupling agent and an inorganic filler are added to an epoxy resin, and then the mixture is stirred uniformly. Subsequently, the mixture was degassed to obtain a photocurable resin composition. "YL980" (bisphenol A type epoxy resin) produced by Epoxy Resins Co., Japan was used as the epoxy resin. "Adecaoptomer SP-150" (aromatic sulfonium salt) produced by ASAHI DENKA was used as a cationic photopolymerization initiator. "KBM-403" (silane coupling agent) produced by SHINETSU was used as the coupling agent. Alumina with different particle sizes are used as inorganic fillers, and they are "AES-11C" (average particle size: 0.4 μm), "AL-M43" (average particle size: 2.7 μm), "AL-M41" produced by SUMITOMO CHEMICAL (average partic...

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PUM

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Abstract

The invention discloses a photocureable resin composition which comprises: (A) 100 parts of epoxide resin by weight; (B) 0.01 to 20 parts of photopolymerization initiator by weight; (C) 0.01 to 10 parts of coupling agent by weight; and (D) 0.01 to 120 parts of mineral filler by weight. The photocureable resin composition can also comprise (E) 0.05 to 10 parts of photo-acid-generator by weight. The photocureable resin composition has improved heat conductibility and a damp insulation function, thereby can be used for producting display devices, such as organic light emitting diode (OLED), liquid crystal displays (LCD) and pliability displays.

Description

field of invention [0001] The present invention relates to a photocurable resin composition, in particular, to a photocurable resin composition capable of easily releasing heat from a device due to improved thermal conductivity and having a better moisture barrier function. In addition, the photocurable resin composition prevents shrinkage during curing, thus does not impair physical properties (adhesive strength, etc.), and can be cured by ultraviolet rays without heating. In addition, the photocurable resin composition can be used to produce display devices, such as organic light emitting diodes (OLEDs), liquid crystal displays (LCDs) and flexible displays (Flexible Displays). Background of the invention [0002] The epoxy resin composition has excellent adhesive strength to metal, shear strength, and tensile strength, but it does not have sufficient peel strength and its impact resistance is low, which may cause cracks, peeling, and the like. Accordin...

Claims

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Application Information

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IPC IPC(8): G03F7/004
CPCC08K3/36C08L63/00
Inventor 孙祯炫朴钟大安寅奭
Owner DONGJIN SEMICHEM CO LTD
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