Method for preparing nano copper powder and copper slurry

A technology of nano-copper powder and copper paste, which is applied in the field of preparation of anti-oxidation nano-copper powder and copper paste. Good performance and dispersibility, easy separation and collection, simple preparation conditions and processes

Inactive Publication Date: 2007-11-28
CENT SOUTH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these methods have realized the preparation of nano-copper, there are more or less operational difficulties, and it is difficult to realize large-scale and continuous production. Disadvantages such as dispersion have not been resolved

Method used

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  • Method for preparing nano copper powder and copper slurry
  • Method for preparing nano copper powder and copper slurry
  • Method for preparing nano copper powder and copper slurry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) Configure 0.5~1.0mol·L -1 Cu 2+ 200ml of aqueous solution, then add 5~10ml of stearic oleic acid into the above aqueous solution and shake vigorously for about 30min; (2) Add 0.5~0.8mol·L -1 50ml of glucose solution, heated in a water bath, and carried out the reduction reaction at a temperature of 40-60°C for about 15 minutes; (3) continue to add 0.5-0.8mol.L -120ml of ascorbic acid was reacted for 30min; cooled down to room temperature, and aged for 60min, the organic phase was separated and collected by overturning method; (5) the separated organic phase was washed with 20-40ml of ethanol and dried to obtain Nano-copper powder; or the organic phase of the coated copper obtained by separation is prepared according to the following formula (weight percentage) to obtain copper conductive paste,

[0034] Organic coated copper 2~20%

[0035] Dispersant (triethanolamine or polyethylene glycol) 0.1~5%

[0036] Stabilizer (sodium carboxymethyl cellulose or sodium car...

Embodiment 2

[0041] (1) Configure 0.5~1.0mol.L -1 Cu 2+ 2000ml of aqueous solution, then add 25-50ml of trans-oleic acid into the above-mentioned aqueous solution and shake vigorously for about 30min; (2) Add 0.5-0.8mol.L -1 500ml of glucose solution, heated in a water bath, and carried out the reduction reaction at a temperature of 40-60°C for about 15 minutes; (3) continue to add 0.5-0.8mol.L -1 200ml of formaldehyde was reacted for 30min; (4) Cool down to room temperature, and after aging for 60min, the organic phase was separated and collected by overturning; (5) The separated organic phase was washed with 50-100ml of acetone and dried to obtain dispersibility and anti-oxidation Nano-copper powder with good properties; or the coated copper organic phase obtained by separation is prepared according to the following formula (weight percentage) to obtain copper conductive paste,

[0042] Organic coated copper 2~20%

[0043] Dispersant (sodium polyacrylate or polyvinylpyrrolidone) 0.1~5...

Embodiment 3

[0049] (1) Configure 0.5~1.0mol·L -1 Cu 2+ 200ml of aqueous solution, then add 5-10ml of oleic acid mixture (volume ratio of stearic oleic acid to trans oleic acid is 1:1) into the above aqueous solution and shake vigorously for about 30min; (2) add 0.5-0.8mol L -1 50ml of glucose solution, heated in a water bath, and carried out the reduction reaction at a temperature of 40-60°C for about 15 minutes; (3) continue to add 0.5-0.8mol.L -1 40ml of hydrazine hydrate was reacted for 30min; (4) cooling down to room temperature, and after aging for 60min, the organic phase was separated and collected by overturning method; (5) the separated organic phase was washed with 20-40ml of ethanol, and after drying, the dispersibility and anti-resistance Nano copper powder with good oxidizability; or the organic phase coated copper obtained by separation is prepared according to the following formula (weight percentage) to obtain copper conductive paste,

[0050] Organic coated copper 2~20%...

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Abstract

The present invention is process of preparing nanometer copper powder and copper slurry with high antioxidant performance. The process includes solvent replacement, the first reduction, the second reduction, separation, drying and other steps. The present invention has the features of simple preparation process at normal temperature and normal pressure, low production cost, the effective protection of produced nanometer copper particle in organic phase, small copper powder size, environment friendly preparation process, etc. The prepared nanometer copper powder and copper slurry may be applied in producing large scale PCB, conducting ink, multilayer ceramic capacitor, etc.

Description

technical field [0001] The invention relates to a preparation method of anti-oxidation nanometer copper powder and copper slurry. Background technique [0002] Since the 1990s, the application of electronic computers has become increasingly popular, which has led to the rapid development of electronic products such as communication equipment, audio-visual equipment, and network information equipment. Household appliances—the rapid rise of electronic product manufacturing industries such as "information home appliances" and "digital home appliances", and the vigorous development of this industry have rapidly driven the development of various electronic pastes and ultra-fine metal powder industries. [0003] Several precious metals such as palladium, platinum, gold, silver, etc. used to have an irreplaceable position in the electronics industry because of their excellent electrical conductivity and application properties. Palladium, platinum, gold, silver and other ultra-fine...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24
Inventor 杨建广唐谟堂杨声海唐朝波何静
Owner CENT SOUTH UNIV
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