Metal polish liquid, and prepartion method
A polishing liquid and metal technology, applied in polishing compositions, chemical instruments and methods, polishing compositions containing abrasives, etc., can solve the problems of poor use effect, difficult cleaning of product surface, and many black discoloration layers, etc. The effect of less sticking, good effect and fast polishing rate
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Embodiment 1
[0014] A kind of metal polishing liquid, is made up of water-soluble silica sol, alkyl alcohol amide, alcohol amine, hexahydroxypropyl propylenediamine and deionized water, and the percentage by weight of various components is: water-soluble silica sol 20%, particle diameter 20-30nm; Alkanolamide 0.3%; Alcoholamine 2%; Hexahydroxypropylpropylenediamine 0.6%; Deionized water is the balance. The preparation method of the polishing liquid is: firstly filter and purify the various components of the prepared polishing liquid, and then pass the various components through the mass The flow meter is input into the container tank and stirred thoroughly, and the mixture is uniform. Dilute the above polishing liquid and deionized water by 1:10, and experiment on Lanxin X62 815-1 single-side polishing machine: at 300g / cm 2 , 40±5°C, 3L±0.3L / min, the coated copper metal is polished at a rate of 0.05μ / min.
Embodiment 2
[0016] A polishing fluid for metals consisting of CeO 2 Hydrosol, fatty alcohol polyoxyethylene ether, sodium hydroxide, tetrahydroxyethylethylenediamine and deionized water, the weight percentage of various components is: CeO 2 30% hydrosol, particle size 30nm-40nm; fatty alcohol polyoxyethylene ether 0.4%; tetramethylamine hydroxide 1%; tetrahydroxyethylethylenediamine 0.9%; deionized water as the balance. The preparation method of the polishing liquid is the same as in Example 1. Dilute the above polishing liquid and deionized water by 1:10, and experiment on Lanxin X62 815-1 single-side polishing machine: at 300g / cm 2 , 40±5°C, 3L±0.3L / min, the coated copper metal was polished at a rate of 0.1μ / min.
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