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Composite board of titanium / copper, and production method

A composite plate and copper plate technology, applied in the field of electrolysis, can solve the problems of high resistance of lead alloy, increase of cell voltage, heat generation, high cost, etc., achieve uniform current distribution, prolong service life, and reduce heat generation

Active Publication Date: 2007-12-26
GRIPM ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional electrolysis process generally uses lead alloys as inert anodes, such as lead-antimony alloys, lead-silver-calcium alloys, etc. , resulting in increased lead content in electrolytic products
[0003] At present, more studies are made on titanium inert anodes, which use titanium as the substrate and coat precious metals such as iridium and ruthenium or their oxides on the surface, which also has the disadvantages of high resistance, short life, and high cost, which limits the popularization and application.

Method used

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  • Composite board of titanium / copper, and production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The surface of the 100×100×10mm copper plate is degreased, cleaned, and sandblasted, and the copper plate is wrapped with a 2mm thick titanium plate, and the titanium plate is welded by argon arc welding to make a titanium / copper composite plate. Then rolling is carried out as required, and annealing is carried out at 850°C for 30 minutes to make a titanium / copper composite plate.

Embodiment 2

[0022] Electroplate or vapor-deposit a 2um silver layer on the surface of a 300×400×10mm copper plate (as shown in Figure 2), at H 2 Heating at 800-1000° C. under a protective atmosphere makes a layer of silver-copper alloy formed on the surface of the copper plate. Other conditions are the same as in Example 1 to make a titanium / copper composite plate.

Embodiment 3

[0024] The surface of the Φ50×100mm copper plate is degreased, cleaned, sandblasted, etc., and assembled with a titanium sleeve with Φ51×Φ60×105mm, and the other end is vacuum-welded by argon arc welding, and first forged into a 40mm thick The "cake" is rolled at 600-800°C, and then cold-rolled on the surface to produce a titanium / copper composite plate with a thickness of 30mm.

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Abstract

This invention discloses a method for preparing titanium / copper composite board, which is composed of a copper board partially or completely coated with a titanium layer. The titanium / copper composite board is prepared by one or more of welding, rolling and hot pressing. The titanium / copper composite board has such advantages as high conductivity, high corrosion resistance and low cost, and can be used as matrix material for inert anode. Inert anode prepared from the titanium / copper composite board has such advantages as low calorific amount, low tank voltage, long service life, uniform current distribution and high electrolytic product purity.

Description

technical field [0001] The invention belongs to the technical field of electrolysis. In particular, it relates to a titanium / copper composite plate used for an inert anode in electrolysis and a preparation method thereof. Background technique [0002] The traditional electrolysis process generally uses lead alloys as inert anodes, such as lead-antimony alloys, lead-silver-calcium alloys, etc. , leading to an increase in lead content in electrolytic products. [0003] At present, more studies are made on titanium inert anodes, which use titanium as the substrate and coat precious metals such as iridium and ruthenium or their oxides on the surface, which also has the disadvantages of high resistance, short life, and high cost, which limits its popularization and application. [0004] At present, the research focus at home and abroad is mainly to carry out a lot of research on the two aspects of alloy system and coating to improve its conductivity. Contents of the invention...

Claims

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Application Information

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IPC IPC(8): C25B11/04B32B15/01
Inventor 王林山汪礼敏张景怀
Owner GRIPM ADVANCED MATERIALS CO LTD
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