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Polyketone fiber paper, polyketone fiber paper core material for printed wiring board and printed wiring board

A technology of printed wiring substrate and polyketone fiber, which is applied in the directions of synthetic cellulose/non-cellulose material pulp/paper, fiber raw material processing, fiber chemical characteristics, etc., can solve the problem of low elastic modulus and easy deformation, high dielectric constant of glass, It can be applied to problems such as limited application to achieve high elastic modulus, high strength, low water absorption and excellent adhesion.

Inactive Publication Date: 2008-01-16
ASAHI KASEI E-MATERIALS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when it is a fiber paper containing polyester fibers, there is room for improvement in dimensional stability due to its low elastic modulus and easy deformation
When it is glass woven fabric or glass non-woven fabric, because of the high dielectric constant of glass, it is not suitable for applications that expect high-frequency characteristics.
On the other hand, polyketone fiber paper core materials and printed wiring substrates obtained by using polyketone fiber paper have not yet appeared on the market.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] Put 100% by mass of aliphatic polyketone short fibers with an average fiber diameter of 10 μm and a fiber length of 3 mm into a high-speed pulverizer (pulper) and then pour water heated to 50 degrees to prepare a water dispersion of polyketone short fibers solution (fiber concentration: 2% by mass), and stirred for 15 minutes. Water was added to this dispersion liquid so that the fiber concentration would be 1% by mass, and 0.5% by mass of an antifoaming agent (polyoxyalkylene glycol fatty acid ester) was added to the fiber mass, followed by stirring in a low-speed stirring tank for 30 minutes. Further, water was added to the fiber dispersion to adjust the slurry concentration to 0.1% by mass, 20 ppm of a viscosity modifier (polyethylene oxide) was added, and vacuum degassing was carried out before papermaking. After the wire paper machine forms wet paper at a papermaking speed of 30m / min, it is heated and dried with a Yankee dryer with a surface temperature of 130°C, a...

Embodiment 2～9

[0086] The polyketone fiber paper and the polyketone fiber paper core material for printed wiring boards were obtained using the aliphatic polyketone fiber shown in Table 2 by the same manufacturing method as in Example 1. Table 2 shows the parts with different conditions in the production method. A printed wiring board was produced by the same method as in Example 1 using this core material.

Embodiment 10

[0088] The polyketone fiber paper core material for printed wiring boards produced in Example 1 was soaked in an epoxy resin with a solid content of 45% (100 parts by mass of polyphenylene ether type epoxy resin and 3 parts by mass of curing agent dicyandiamide) In the solution, a printed wiring board was produced in the same manner as in Example 1.

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Abstract

An aliphatic polyketone fiber paper comprising aliphatic polyketone fibers and a polyketone fiber paper core material for a printed wiring board are provided. The polyketone fiber paper and the core material have high strength and modulus of elasticity; excellent dimensional stability, chemical resistance, heat resistance, adhesiveness and electrical insulation; and low dielectricity and water absorbance, and are thin, porous, and uniform. A printed wiring board prepared from the core material having a low dielectric constant, dimensional stability, electrical insulation, and properties of being uniformly bored by laser punching is also provided. The aliphatic polyketone fiber paper and the core material for a printed wiring board comprises 1 to 100% by mass of aliphatic polyketone fibers which comprise the repeating unit of the below-mentioned formula (1), the fibers having an average fiber length of 0.5 to 10 mm, an average fiber diameter of 0.1 to 20 [mu]m, a thickness of 5 to 200 [mu]m, a void ratio of 30 to 90%, and a strength per unit mass of 100 MN / kg or more. Also provided is a single layer or multilayer printed wiring board which comprises a core material impregnated or coated with a polymer resin, a low dielectric polymer resin, or a polyphenylene ether-based epoxy resin. -CH 2 -CH 2 -CO- (1).

Description

technical field [0001] The present invention relates to a polyketone fiber paper containing 1% to 100% by mass of aliphatic polyketone fiber obtained by a wet papermaking method, a polyketone fiber paper core material for printed wiring boards, and a polyketone fiber paper core material applied printed wiring substrates. [0002] More specifically, the present invention relates to the following polyketone fiber paper, a polyketone fiber paper core material for printed wiring boards, and a printed wiring board using a polyketone fiber paper core material, which contain aliphatic polyketone fibers, Has high strength, high elasticity, is excellent in dimensional stability, chemical resistance, heat resistance, adhesion and electrical insulation, has low dielectric properties, low water absorption, is light and thin, and is porous And the holes are uniform. Background technique [0003] In recent years, research has been conducted on synthetic fiber paper obtained by papermaki...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21H13/22D01F6/76
Inventor 白鸟直行樋口正男松下文夫
Owner ASAHI KASEI E-MATERIALS CORPORATION
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