Tungsten copper powder high compactedness material and method for preparing the material using heat extrusion

Abstract

A wolfram steel powder high-density material and a method of hot extrusion for producing the material belong to metal composite material and producing method. The method solves the problem that the cost of equipment used in present method is high; the technical process is complicated and the density is a bit low; the energy consumption is great and the production efficiency is low; the density is low with the melt infiltration method and the combination of two metals is not good. The wolfram steel powder high-density material is made according to the weight percent that wolfram accounts for 50 to 90 percent and copper accounts for 10 to 50 percent. The producing method is that wolfram and copper powders are taken as the raw materials; a mechanical ball is used to grind the raw material; the process of cold-press shaping is implemented; the material is put in a steel sleeve and the sleeve is welded after the sleeve being sealed; the material is heated and put into a mold cavity; the material is extruded with a squeeze head and the high-density material will be obtained. The present invention solves the problem that with the traditional method of sintering and infiltration and hot isostatic method, the wolfram and copper material density is low and the two materials can not melted together and the problem that the producing method for regular deformed composite material adopts great extrusion ratio which is hard to be applied in industry.

Description

technical field [0001] The invention relates to an intermetallic composite material and a preparation method thereof, in particular to a method for preparing the composite material by hot extrusion plastic deformation of W and Cu powders. Background technique [0002] Tungsten-copper powder metallurgy composite material is composed of tungsten with high melting point and high hardness and copper with high electrical conductivity and thermal conductivity, which combines the advantages of tungsten and copper. At present, it is widely used as electrode materials for resistance welding, EDM and plasma spraying, electronic packaging materials, computer central processing systems, lead frames for large-scale integrated circuits, and heat sink substrates for electronic devices such as solid-state microwave tubes. Because tungsten and copper are incompatible with each other, only pseudoalloys are formed between the two, so it is difficult to produce highly dense tungsten copper mate...

AI Technical Summary

Problems solved by technology

[0003] The present invention solves problems such as high equipment cost, complex process, high energy consumption, low production efficiency and low density of produced materials in the existing method for preparing dense materials from W and Cu powders, and the density of materials prepared by infiltration method is Low, poor combination of two phases; the density of the material obtained by the conventional sintering method is low; the production efficiency of the hot isostatic pressing method is low, the cost is high, and it is difficult to achieve mass production. A tungsten copper powder with high density is provided. Material and adopt hot extrusion to prepare the method for this material, the specific technical scheme that solves the above-mentioned problem is as follows: