Pressure-sensitive adhesive sheets for wafer grinding and warp inhibiting

A pressure-sensitive adhesive sheet, pressure-sensitive adhesive layer technology, applied in the direction of film/sheet-like adhesives, applications, adhesives, etc., can solve the problem of expensive pressure-sensitive adhesive sheets, complicated steps, and not always performance. best and so on

Inactive Publication Date: 2008-02-13
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this pressure-sensitive adhesive sheet has the disadvantage that the steps of producing the material constituting the base material and the process of producing the base film are complicated, and as a result, the completed pressure-sensitive adhesive sheet is very expensive
In addition, although the pressure-sensitive adhesive sheet has excellent performance when used as a pressure-sensitive adhesive sheet for back grinding of large-diameter semiconductor wafers, the performance is not always optimal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] In toluene, 97 parts by weight of butyl acrylate, 2 parts by weight of methyl methacrylate, and 3 parts by weight of acrylic acid were copolymerized by a solution polymerization method to obtain an acrylic polymer having a weight average molecular weight of 550,000. 100 parts by weight of this acrylic polymer was mixed with 0.3 parts by weight of an epoxy crosslinking agent (trade name "TETRAD C", manufactured by Mitsubishi Gas Chemical Co., Ltd.) to obtain a pressure-sensitive adhesive composition A. Using a fountain die method, the pressure-sensitive adhesive composition A was applied to a processing sheet for casting (50 μm-thick PET film, produced by Toray Industries, Inc.) in an amount such that a dry thickness of 20 μm was obtained. . In this way, a pressure-sensitive adhesive layer was formed.

[0057] A laminated film A having a thickness of 150 μm and including a three-layer structure of polyethylene / amorphous polypropylene / polyethylene was prepared as a subst...

Embodiment 2

[0059] In toluene, 50 parts by weight of ethyl acrylate, 50 parts by weight of butyl acrylate, and 5 parts by weight of acrylic acid were copolymerized to obtain an acrylic polymer having a weight average molecular weight of 650,000. 100 parts by weight of this acrylic polymer was mixed with 20 parts by weight of an ultraviolet curable oligomer (trade name "UV-1700", produced by The Nippon Synthetic Chemical Industry Co., Ltd.), 1 part by weight of polyisocyanate cross-linked (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) and 3 parts by weight of a photopolymerization initiator (trade name "Irgacure 651", manufactured by Ciba Specialty Chemicals Co.). In this way, an energy ray-curable acrylic pressure-sensitive adhesive composition B was obtained.

[0060] Subsequent operations were performed in the same manner as in Example 1 except that pressure-sensitive adhesive composition B was used instead of pressure-sensitive adhesive composition A. In this...

Embodiment 3

[0062] The same procedure as in Example 1 was performed except that a polyimide film (trade name "200H", manufactured by Du Pont-Toray Co., Ltd.) having a thickness of 50 μm was used as a base material. In this way, a pressure-sensitive adhesive sheet C was obtained.

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Abstract

The present invention relates to a pressure-sensitive adhesive sheet for semiconductor wafer processing, which includes a substrate and a pressure-sensitive adhesive layer disposed on the substrate, the pressure-sensitive adhesive sheet or said substrate having a thermal shrinkage ratio of 2% or lower after having been allowed to stand at 60 DEG C. for 10 minutes. This pressure-sensitive adhesive sheet preferably has a degree of elongation of 2% or lower in a silicon wafer application test of the pressure-sensitive adhesive sheet. According to this pressure-sensitive adhesive sheet, the back side of a semiconductor wafer can be ground to an extremely small thickness without bending the wafer.

Description

technical field [0001] The present invention relates to a pressure-sensitive adhesive sheet used in semiconductor wafer processing. More particularly, the present invention relates to a pressure-sensitive adhesive sheet suitable for semiconductor wafer processing in which a semiconductor wafer is ground to a very small thickness. Background technique [0002] In recent years, various packages and IC cards have been promoted, and it is desired to further reduce the thickness of electronic components including semiconductor chips. It is therefore necessary to reduce the thickness of the semiconductor chip, which is already about 350 μm, to 75-150 μm or less. Furthermore, the use of even larger wafers is being investigated in order to improve productivity. [0003] In the production of semiconductor wafers, a technique of grinding the backside of the wafer after forming circuit patterns has been employed. During this process, a pressure-sensitive adhesive sheet is applied to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02B24B29/00B24B55/00H01L21/304B32B7/028C09J7/29
CPCC09J2201/162H01L21/6836B32B7/12C09J2423/006H01L2221/68327H01L21/6835C09J2203/326H01L2221/6834C09J7/0296B32B27/32C09J2201/622B32B27/08B32B27/16B32B2250/24B32B2307/308B32B2307/50B32B2405/00B32B2457/00C09J7/29Y10T428/28Y10T428/2848C09J2301/162C09J2301/312B32B7/028H01L21/304
Inventor 新谷寿朗
Owner NITTO DENKO CORP
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