Base tube prepared from modified polyimide film and its preparation method
A technology of polyimide film and modified material, which is applied in the equipment of electric recording process applying charge pattern, electric recording process applying electric charge pattern, application, etc. Short, poor fixing effect, etc., to achieve the effect of convenient preparation method, improved mechanical properties of materials, and long service cycle
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Embodiment 1
[0013] Embodiment 1: 2180 grams (10 moles) of pyromellitic dianhydride (PMDA) and 2000 grams (10 moles) of 4,4'-diaminodiphenyl ether (ODA), and polar solvent 21945 grams of dimethyl Acetamide (DMAC) (16% solid content) is put into the reactor and stirred for 2-10 hours to polymerize into the main material—polyamic acid resin. Then, add 214 grams of nano-silica powder (accounting for 5% of the resin solid content) into the reaction kettle, and stir at room temperature for 2-10 hours to prepare the modified polyamic acid resin. The modified polyamic acid resin is coated on the aluminum pipe with a mirror surface by the dip coating method, and after casting for 10-20 minutes, it is sent to the drying equipment, and the initial temperature of the drying equipment is 30- 60°C, gradually increase the temperature to 220-250°C, keep the temperature constant for 2 hours, take it out and cool it, and obtain a base film with a thickness of 20-30 microns.
Embodiment 2
[0014] Embodiment 2: 2180 grams (10 moles) of pyromellitic dianhydride (PMDA), 2000 grams (10 moles) of 4,4'-diaminodiphenyl ether (ODA), and polar solvent 21945 grams of dimethyl Acetamide (DMAC) 16% solid content) is put into the reactor and stirred for 2-10 hours to polymerize into the main material—polyamic acid resin. Then add 292.6 grams of nano silicon dioxide (SiO 2 ) powder and 125.4 grams of nano-alumina (Al 2 o 3 ) powder (the sum of the weights of the two powders accounts for 10% of the solid weight of the resin). Made into modified polyamic acid resin. Dip coating with a stainless steel tube, cast for 20-30 minutes, and then send it to a drying device. The heating and drying conditions are the same as in Example 1 to obtain a base film with a thickness of 30-40 microns.
Embodiment 3
[0015] Embodiment 3: 2180 grams (10 moles) of pyromellitic dianhydride (PMDA), 2000 grams (10 moles) of 4,4'-diaminodiphenyl ether (ODA), and polar solvent 21945 grams of dimethyl Acetamide (DMAC) mole) 4,4'-diaminodiphenyl ether (ODA), and polar solvent 21945 grams of dimethylacetamide (DMAC) 16% solid content) are put into reaction kettle and stirred for 2-10 hours Polymerized into the main material - polyamic acid resin. Then add 209 grams of nano silicon dioxide (SiO 2 ) powder, 209 grams of nano titanium dioxide (TiO 2 ) powder and 209 grams of nano zirconia (ZrO 2 ) powder (the sum of the three powder weights accounts for 15% of the solid weight of the resin). Made into modified polyamic acid resin. Dip coating with polytetrafluoroethylene pipes, cast for 30-40 minutes, and send to drying equipment. The heating and drying conditions are the same as those in Example 1 to obtain a base film with a thickness of 40-50 microns.
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