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A low temperature flip chip welding method of macromolecule electric conducting material of template printing

A polymer conductive and stencil printing technology, applied in printing, circuits, electrical components, etc., can solve the problems of limited application of lead-free solder paste, high melting point, etc., achieve the effects of small thermal stress, low process temperature, and improved reliability

Active Publication Date: 2010-06-23
厦门清芯集成科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high melting point of lead-free solder paste, for example, the melting point of Indium's SAC series lead-free solder paste is about 217-218°C, which limits the application of lead-free solder paste

Method used

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  • A low temperature flip chip welding method of macromolecule electric conducting material of template printing
  • A low temperature flip chip welding method of macromolecule electric conducting material of template printing
  • A low temperature flip chip welding method of macromolecule electric conducting material of template printing

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The specific process implementation steps of this selected embodiment are:

[0050] 1. Design and manufacture printing template 9;

[0051] 2. Clean the chip 1 and the substrate 4 that need to be flipped, and remove the organic matter and other contamination on the surface of the pads 2 and 6;

[0052] 3. Use the template 9 to print the conductive polymer material 7 on the pad 2 on the surface of the chip 1 to form bumps;

[0053] 4. Put the chip 1 printed with polymer conductive material into the holding furnace for curing;

[0054] 5. Use the template 9 to print the conductive polymer material 7 on the substrate 4 to form bumps;

[0055] 6. Flip-chip the cured chip 1 and the substrate 4 printed with conductive polymer material but not cured;

[0056] 7. Put the flip-chip chip 1 and substrate 4 into a holding furnace for curing;

[0057] 8. Use non-conductive polymer material 8 to fill the bottom of the cured flip chip;

[0058] 9. Put the underfilled flip chip in...

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Abstract

The invention relates to a low-temperature flip chip bonding method by using a template printing polymer conductive material, which pertains to the encapsulation technology, in particular to the flip chip technical field of an integrated circuit and a micro-electro-mechanical system (MEMS), the invention is characterized in that a template is used for printing the polymer conductive material on achip and a pad of a substrate to form convex points, then the chip and the pad of the substrate are aligned and are arranged in a temperature keeping furnace with the temperature of less than 150 DEGC for curing, the chip and the substrate realize the conductive connection and form a whole body, finally the non-conductive polymer material is filled between the chip and the substrate to form a whole system. The invention has the advantages that the invention does not need to produce a metalizing layer under the convex points, the process temperature is low, the mechanical performances are good and the reliability is high, at the same time, the invention also reduces or eliminates equipment for post-treatment of washing residues.

Description

technical field [0001] The invention belongs to the field of flip-chip welding in the packaging of integrated circuits and micro-electromechanical systems (MEMS), and is particularly suitable for devices that cannot be processed at high temperatures. Background technique [0002] IC design, chip manufacturing and packaging testing are called the three major industries of the semiconductor industry. Statistics show that China will become one of the world's IC packaging bases. Therefore, the research on packaging technology is of great significance to the development of China's semiconductor industry. The role of the package is to provide electrical interconnection, mechanical support, mechanical and environmental protection, and heat dissipation channels between the die (chip) and the printed circuit board (PCB). With the reduction of the characteristic size of the integrated circuit, the packaging density is required to be higher and higher, thus putting forward higher req...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60B81C3/00
CPCH01L2224/16225H01L2224/73204H01L24/81H01L2224/92125H01L2224/32225H01L2924/00011H01L2924/01322H01L2924/14H01L2924/1461H01L2924/351
Inventor 蔡坚薛琳王水弟贾松良
Owner 厦门清芯集成科技有限公司