Enhanced type infrared absorption plate for optical read-out heat type infrared image sensor and preparation method thereof

Abstract

The invention relates to a reinforcing type infrared absorption plate in optic readable thermal infrared image sensor and the corresponding preparation method. The reinforcing type infrared absorption plate has structural style that: a non-metallic infrared absorbing film is used as a lower layer and a metallic coating is used as an upper layer so as to form a monolayer structure. The reinforcing type infrared absorption plate has structural characteristics that: anti-bending reinforcements are arranged at the bottom of the infrared absorption film, the anti-bending reinforcements and the non-metallic infrared absorption film have same or different materials. The reinforcing type infrared absorption plate in optic readable thermal infrared image sensor solves the contradiction between the thickness and the flatness of the infrared absorbing plate in the form of simple structure, thereby furthermore improving FPA performance. The reinforcing type infrared absorption plate has simple technique and is easy to be implemented.

Description

Technical field [0001] The invention relates to an infrared absorption plate in an optically read-out thermal infrared image sensor and a preparation method thereof, more specifically to an infrared absorption plate in an optically read-out thermal infrared image sensor based on a microbeam array and a single-layer film structure And its preparation method. Background technique [0002] The peak band of infrared radiation of objects at room temperature is 8-14 microns. Infrared imaging for this band mainly includes quantum and thermal imaging devices. [0003] Quantum infrared imaging requires cooling of the target surface of the detector, and additional cooling equipment makes the entire device bulky and expensive, which is not conducive to civilian use and mass popularization. [0004] The thermal imaging device does not require a refrigeration device, reduces the volume, reduces the cost, maintains high precision, and has a wide range of application prospects. The thermal infr...

AI Technical Summary

Problems solved by technology

[0009] Previously, in the invention patent specification with the publication number: CN1970430, the inventor further proposed to use a double-layer resonant cavity to solve the problem of affecting the performance of the FPA caused by the deformation of the infrared absorbing plate, but the double-layer resonant cavity The structural form is too complicated, and the sacrificial layer and its release process must be used in the production, but the release process of the sacrificial layer is difficult and the yield is extremely low, so the production cost is expensive

Images