Temperature equalization line beat heating plate device

Abstract

The invention provides an average temperature wire bonding hot plate device, which comprises a hot plate body, wherein, the hot plate body is provided with an upper surface and a relative lower surface which is provided with a heating area; the heating area divides the lower surface into at least one first area and at least one second area. The invention also comprises at least one row of wire bonding areas which are arranged on the upper surface of a hot plate, and heat conducting materials which are arranged inside the first area and the second area and form a heat-conducting contact state together with the first area and the second area.

Description

technical field [0001] The present invention relates to the electrical connection between IC (Integrated Circuit) chip and the mounting carrier by wire bonding, especially the temperature control of the wire bonding. Background technique [0002] The manufacturing process of integrated circuits can be divided into pre-engineering and post-engineering. Pre-engineering mainly includes film formation, printing and etching, heat treatment and other processes, while post-engineering includes steps such as assembly, processing and testing. No matter how high the degree of completion of the pre-project is, the integrated circuit (IC) chip must be electrically connected with the carrier of the structure in order to exert its existing functions. [0003] Existing electronic packaging mainly uses three methods to electrically bond the carrier and the IC chip. The first method is TAB (Tape Automated Bonding) technology, which uses a tape with a circuit pin pattern to bond the IC chip. ...

AI Technical Summary

Problems solved by technology

[0003] Existing electronic packaging mainly uses three methods to electrically bond the carrier and the IC chip. The first method is TAB (Tape Automated Bonding) technology, which uses a tape with a circuit pin pattern to bond the IC chip. According to the structure of the tape, it can be divided into three types: single-layer, double-layer and three-layer. Among them, the single-layer tape can be made of copper, aluminum, nickel, steel or stainless steel sheet, which is cheap, but it cannot be electrically The main disadvantage is that it is non-testable and prone to deformation.

The double-layer tape is to coat the polymer material on the copper foil, and then make the circuit pin pattern and the device hole (Device Hole) on the tape by etching method, which can provide better strength. But it has the disadvantages of being easily deformed and expensive

The TAB technology of three-layer tape can provide complex circuit pin pattern design and pin flatness, but its cost is high, the manufacturing process is complicated, and it is not suitable for high-temperature bonding process because the tape uses adhesives.

[0008] However, this existing configuration will cause problems of heating and uneven heating in the actual production process, and it is easy to cause cold welding and empty welding in the production process to reduce the yield rate. In severe cases, it may even cause a short circuit of the integrated circuit. Otherwise, the performance of the wire bonding machine will be different between the cold machine and the hot machine state, so the phenomenon of uneven heating will affect the temperature change of the machine, and then produce welding wire waste

[0009] To sum up, the existing methods of electrical connection between integrated circuit (IC) chips and the assembled carrier have their defects. However, the wire bonding technology is simple and convenient, and the utilization rate of the existing market share is the highest. Therefore, the present invention aims to To provide a uniform temperature bonding hot plate device to overcome the shortcomings of the prior art

Images