Polycrystal silicon chip water-base cleaning agent

Abstract

The invention discloses a monocrystalline silicon slice water-based cleaning agent, which is characterized in that the cleaning agent is pale yellow transparent liquid, and comprises the following components in weight ratio as follows: surface active agent 20-40, dissolving agent 5-15, brightening agent 10-20, dispersing agent (TD-1 and TD-2) 10-18, pH regulator 15-20, and deionized water 30-40. The surface detergency is improved and the constancy of the cleanliness is kept through utilizing the compound property of the surface active agent; simultaneously, the cleaning agent can ensure that the silicon slice after being cleaned is free from water trace and brighter, and has good cleaning effect to monocrystalline silicon slices and other materials; and the cleaning speed and the durability are improved. The compound concentration is low, and the used material quantity is less, therefore the use-cost of users is reduced, and the sewage discharge is reduced, so as to achieve the purposes of energy conservation and emission reduction.

Description

Technical field: [0001] The invention relates to an ultrasonic cleaning agent for silicon wafers, in particular to a water-based cleaning agent for polysilicon wafers which can improve descaling ability, cleaning speed and durability. Background technique: [0002] Silicon wafers are firstly cut into slices of silicon rods, and undergo grinding, polishing, corrosion and other processes to obtain a smooth and smooth surface, and then undergo complex processing processes such as cleaning, oxidation, photolithography, epitaxial growth, and solid-state diffusion. form semiconductor materials. The cleaning is mainly to remove the sand particles generated during the cutting process, the residual water-soluble wire cutting suspension, metal ions, fingerprints, etc. The cleaning effect will directly affect the quality of the silicon wafer. Residue and other technical requirements. At present, with the increasing growth rate of solar cells, the demand for cleaning fluid is also inc...

AI Technical Summary

Problems solved by technology

At present, with the increasing growth rate of solar cells, the demand for cleaning fluid is also increasing year by year, but so far there is no ultrasonic cleaning fluid dedicated to polycrystalline silicon wafers.

The existing cleaning solution has the disadvantages of poor descaling ability, slow cleaning speed and poor durability, resulting in high concentration and large amount of cleaning solution for operation, which directly increases the production cost. Emissions, not conducive to environmental protection