Mobile phone drive chip interconnection module group and method for producing the same
A technology for driving chips and driving circuit chips, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as mobile phone performance constraints, achieve good application prospects and market prospects, and reduce production costs and production cycles. Effect
Inactive Publication Date: 2008-12-03
SHANGHAI UNIV
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Problems solved by technology
However, the current electrical connection method is mainly realized through ACF conductive particles, which has many disadvantages and greatly restricts the improvement of mobile phone performance.
If ACF is not used for connection, but NCF is used as the adhesive film, and 1-1.5 micron tin is sputtered on the surface of the gold bump, the contact area between the bump and the glass substrate is increased from 40% of the original use of ACF to 100%, plus AuSn can be formed under the thermocompression bonding process 4 Intermetallic compound, this kind of intermetallic compound has very good hardness, although the shear strength is low, but with the cooperation of non-conductive adhesive film, it can achieve better electrical performance and reliability than ACF
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[0026] The invention will now be more fully described with reference to the accompanying drawings:
[0027] see figure 1 and figure 2 , The first embodiment of the present invention: the manufacturing method uses a drive circuit chip made with metal pads. Its preparation process is as follows:
[0028]Prepare a glass substrate 6 as a substrate interconnected with the drive circuit chip; deposit a layer of molybdenum-chromium material on the glass substrate as a transparent circuit 5, so as to avoid short circuits between different gold bumps. The preparation method can use evaporation , sputtering, and chemical vapor deposition technology, the thickness of the transparent circuit is between 100 nanometers and 200 nanometers, and then the pattern corresponding to the chip bump is made by wet etching with a mask as the connecting circuit. The metal pad structure on the drive circuit chip is a titanium-copper metal film material 2, which is respectively located on the surface...
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The invention relates to a mobile phone drive chip interconnecting module and a preparation method thereof. The drive chip interconnecting module comprises a drive circuit chip which takes a plurality of layers of metal thin films as metallization layers under interconnecting convex points, a glass substrate with a molybdenum chromium material transparent circuit and an adhesive film which is constituted by NCF material, and an interconnecting circuit which is constituted by the interconnecting convex points on the circuit chip is a gold convex point which is plated with tin on the surface. The preparation method is characterized in that the gold convex point is produced on the chip to be used as an interconnecting electrode, a tin layer is produced at the lower surface of the gold convex point, and the heat pressing bonding synthesis or the heat ultrasonic bonding method is adopted to interconnect the drive circuit chip and the glass substrate by the tin-plated gold convex point and the NCF. The mobile phone drive chip interconnecting module and the preparation method thereof can reduce the resistance value in the contact and improve the reliability of the system under the situation of high-density interconnecting package of the mobile phone drive chip.
Description
technical field [0001] The invention relates to a mobile phone drive chip interconnection module and a preparation method thereof, in particular to a non-conductive adhesive gold interconnection method for reducing contact resistance drift and improving bonding reliability. Background technique [0002] Judging from the development trend of technology and application, the system integration design of driver IC on flat panel display device is becoming more and more important. Due to the increasing demand for large-size LCD and high-quality image applications, it is becoming more and more difficult to connect external leads with high density, high pin count, and finer spacing. The current TCP (Tape Carrier Package) technology cannot meet the spacing of less than 40 μm, so that It has promoted the development of packaging technologies such as a new generation of COF (Chip-on-Film) and COG (Chip-on-Glass) respectively suitable for large-size and small-size driver ICs, and FCOG a...
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IPC IPC(8): H01L23/488H01L23/485H01L21/60H01L21/603H01L21/607
CPCH01L2924/0002
Inventor 张建华袁方袁志华华子恺薛克
Owner SHANGHAI UNIV