Middle and low temperature curing conductive silver slurry

A technology of conductive silver paste and low temperature, applied in the direction of conductive materials, conductive materials, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of affecting service life, low curing temperature, insufficient adhesion and adhesion and other problems to achieve the effect of improving efficiency and shortening drying time

Inactive Publication Date: 2009-02-25
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the different shapes, thicknesses and materials of glass substrates required, some glass substrates are prone to softening and deformation when exposed to high temperatures. Therefore, if medium and high temperature pastes are used for printing, the drying and sintering process requires higher temperature control requirements. If the temperature control is not well adjusted, it will affect the substrate and the effect of the paste after printing
However, the silver paste cured at low temperature is not strong enough for the glass substrate due to its low curing temperature, which affects its service life.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Embodiment 1: the conductive silver paste of the present invention contains by mass percentage: 60% silver powder, 8% glass powder, 30% organic solvent, 0.1% macromolecular resin, and surplus is additive; Wherein macromolecular resin is Bisphenol A epoxy resin E51, the silver powder is spherical silver powder, the particle diameter of the silver powder is 1-10μ, the tap density is 2.0-2.5g / ml; the glass powder is low-melting glass powder, its softening point is 300 ℃, melting point The temperature is 340°C; the organic solvent is dichloroethane; the additive is phenolic resin PF-213.

Embodiment 2

[0009] Embodiment 2: the conductive silver paste of the present invention contains by mass percentage: 70% silver powder, 5% glass powder, 20% organic solvent, 1% macromolecular resin, and surplus is additive; Wherein macromolecular resin is Bisphenol A epoxy resin E51, the silver powder is spherical silver powder, the particle diameter of the silver powder is 1-10μ, the tap density is 2.0-2.5g / ml; the glass powder is low-melting glass powder, its softening point is 300 ℃, melting point It is 340°C; the organic solvent is acetone; the additive is 2,4-dimethylimidazole.

Embodiment 3

[0010] Embodiment 3: the conductive silver paste of the present invention contains by mass percentage: 68% silver powder, 3% glass powder, 15% organic solvent, 5% macromolecular resin, and surplus is additive; Wherein macromolecular resin is Bisphenol A epoxy resin E51, the silver powder is spherical silver powder, the particle diameter of the silver powder is 1-10μ, the tap density is 2.0-2.5g / ml; the glass powder is low-melting glass powder, its softening point is 300 ℃, melting point It is 340°C; the organic solvent is benzyl alcohol; the additive is hexahydrophthalic anhydride.

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Abstract

The invention relates to a middle and low temperature curing conductive silver paste. The conductive silver past (by mass percentage )contains 60 to 80 percent of silver powder, 1 to 10 percent of glass powder, 10 to 30 percent of organic solvent, 0.1 to 5 percent of macromolecule resin, and the remaining amount of additive. Compared with the prior art, the curing temperature is 300 to 400 DEG C, the conductive silver paste can be used as a plasma TV dielectric paste and a DBD plane light source paste. Since the curing temperature of the paste is lower, the quality of the product and the production efficiency can be improved.

Description

technical field [0001] The invention relates to a conductive paste for screen printing, in particular to a medium-low temperature curable conductive paste. Background technique [0002] Flat fluorescent lamps have attracted much attention in the flat panel display industry due to their advantages of uniform light emission over a large area, long life, and no pollution. At the same time, flat fluorescent lamps can also be used as general lighting sources, such as ceiling lamps, chandeliers and wall lamps, etc., which have a better decorative effect. [0003] In the application field of flat fluorescent lamps, glass substrate is the most commonly used substrate. According to different needs, it is often necessary to print conductive paste on the glass substrate to achieve its technological purpose. Due to the different shapes, thicknesses, and materials of glass substrates required, some glass substrates are prone to softening and deformation when exposed to high temperature...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/00H01B1/16H01B1/22H01J9/02
Inventor 朱万超
Owner IRICO
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