Alloy film capable of improving exchange bias field size and enhancing exchange bias stability, as well as preparation method thereof
A technology of alloy film and bias field, applied in the application of magnetic film to substrate, magnetic layer, metal material coating process, etc.
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Embodiment 1
[0014] Example 1: Glass / Cu(6nm) / NiFe(6nm) / FeMn(3nm) / Au(6nm) exchange bias sample and glass / Cu(6nm) / NiFe(6nm) / FeMn (0.975) MgO (0.025) (3nm) / Au(6nm) exchange bias sample
[0015] Glass / Cu(6nm) / NiFe(6nm) / FeMn(3nm) / Au(6nm) exchange bias samples and glass / Cu(6nm) / NiFe(6nm) were prepared by computer-controlled multifunctional magnetron sputtering equipment / FeMn (0.975) MgO (0.025) (3nm) / Au(6nm) exchange biased samples where glass was used as the substrate. The details are as follows: put the cleaned substrate into the sputtering chamber, vacuumize, and wait for the background vacuum of the chamber to drop to 2.0×10 -5 At Pa, argon is passed through, and the argon pressure is maintained at 0.4-0.5Pa; the magnetron sputtering method is adopted, and the Cu target is firstly sputtered by DC, with a power of 30W and a current of 0.167A, and the sputtering rate is Then sputter the NiFe target, the power is 60W, the current is 0.196A, and the sputtering rate of the NiFe film is con...
Embodiment 2
[0016] Embodiment 2: Glass / Cu(6nm) / NiFe(6nm) / FeMn (1-x) MgO (x) (tnm) / Au(6nm) exchange bias sample t=3,5,7
[0017] The substrate glass Cu(6nm) / NiFe(6nm) / FeMn was prepared by computer-controlled multifunctional magnetron sputtering equipment (1-x) Mg0 (x) (tnm) / Au(6nm) (t = 3, 5, 7) exchange biased samples where glass was used as the substrate. The details are as follows: put the cleaned substrate into the sputtering chamber, vacuumize, and wait for the background vacuum of the chamber to drop to 2.0×10 -5 At Pa, argon is passed through, and the argon pressure is maintained at 0.4-0.5Pa; the magnetron sputtering method is adopted, and the Cu target is firstly sputtered by DC, with a power of 30W and a current of 0.167A, and the sputtering rate is Then sputter the NiFe target, the power is 60W, the current is 0.196A, and the sputtering rate of the NiFe film is controlled at Then DC sputtering the FeMn target, the power is 60W, the current is 0.122A, and the sputtering r...
Embodiment 3
[0018] The substrate glass Cu(6nm) / NiFe(6nm) / FeMn was prepared by computer-controlled multifunctional magnetron sputtering equipment (1-x) MgO (x) (3nm) / Au(6nm) exchange biased samples where glass was used as the substrate. The details are as follows: put the cleaned substrate into the sputtering chamber, vacuumize, and wait for the background vacuum of the chamber to drop to 2.0×10 -5 At Pa, argon is passed through, and the argon pressure is maintained at 0.4-0.5Pa; the magnetron sputtering method is adopted, and the Cu target is firstly sputtered by DC, with a power of 30W and a current of 0.167A, and the sputtering rate is Then sputter the NiFe target, the power is 60W, the current is 0.196A, and the sputtering rate of the NiFe film is controlled at Then DC sputtering the FeMn target, the power is 60W, the current is 0.122A, and the sputtering rate is FeMn film is obtained; or co-sputtering of FeMn and MgO targets, DC sputtering of FeMn targets, the power is 60W, the ...
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