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Frequency selection surface wave-absorbing material and preparation method thereof

A frequency-selective surface and wave-absorbing material technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve problems such as large surface density, achieve low surface density, simple equipment, and good wave absorption performance effect

Inactive Publication Date: 2009-06-03
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there are many types and preparation methods of wave-absorbing materials, but they are mainly made by adding magnetic powder materials such as iron powder as wave-absorbing agents. Disadvantages; In addition, it is difficult for traditional wave absorbing agents to have a breakthrough development in terms of wave absorbing performance, which requires continuous replacement of new wave absorbing agents, which will definitely be a technical problem
[0004] Although frequency-selective surfaces have been widely used, there are still few studies on absorbing materials, especially in the design and preparation of absorbing materials. Related theoretical issues and experimental work still need to be studied deepen

Method used

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  • Frequency selection surface wave-absorbing material and preparation method thereof
  • Frequency selection surface wave-absorbing material and preparation method thereof
  • Frequency selection surface wave-absorbing material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1. Cut out 10 pieces of 18×18(cm) glass fiber cloth and accurately weigh its weight as 74.0g.

[0032] 2. Weigh 74.3g of epoxy resin and 37.7g of polyamide with a molecular weight of 200, so that the mass ratio of glass fiber cloth, epoxy resin, and curing agent is 2:2:1.

[0033] 3. Add the weighed epoxy resin and low molecular weight polyamide into the same beaker, and dilute with 50ml of acetone to dissolve it. And through the ultrasound machine to make it completely evenly distributed. 4. Brush the above-prepared solution evenly on 10 layers of glass fiber cloth with a wool brush, and let it dry.

[0034] 5. Stack 10 layers of glass fiber cloth, and arrange 4 "ten" shaped aluminum foils in a 2×2 manner between the 4th and 5th layers.

[0035] 6. Arrange the superimposed glass fibers on a flat vulcanizing machine, and press them for 90 minutes under the conditions of the temperature of the upper plate at 124°C, the temperature of the lower plate at 128°C, and the p...

Embodiment 2

[0039] 1. Cut 18 pieces of 18×18(cm) glass fiber cloth and accurately weigh its weight as 121.2g.

[0040] 2. Weigh 122.5g of epoxy resin and 60.8g of polyamide with a molecular weight of 700, so that the mass ratio of glass fiber cloth, epoxy resin, and curing agent is 2:2:1.

[0041] 3. Add the weighed epoxy resin and low molecular weight polyamide into the same beaker, and dilute with 75ml of acetone to dissolve it. And through the ultrasound machine to make it completely evenly distributed.

[0042] 4. Brush the above prepared solution evenly on 18 layers of glass fiber cloth with a wool brush, and let it dry.

[0043] 5. Lay 18 layers of glass fiber cloth, and arrange 9 "ten" shapes made of Fe powder in a 3×3 manner between the 6th and 7th layers, and place each 4 "ten" Place 1 aluminum foil "ten" in the middle, and place 13 aluminum foil "ten"s between the 12th and 13th layers in the same arrangement.

[0044] 6. Arrange the superimposed glass fibers on a flat vulcani...

Embodiment 3

[0048] 1. Cut 18 pieces of 18×18(cm) glass fiber cloth and accurately weigh its weight as 117.8g.

[0049] 2. Weigh 118.0g epoxy resin and 58.5g low molecular weight (molecular weight 450) polyamide respectively, so that the mass ratio of glass fiber cloth, epoxy resin, and curing agent is 2:2:1.

[0050] 3. Add the weighed epoxy resin and low molecular weight polyamide into the same beaker, and dilute with 75ml of acetone to dissolve it. And through the ultrasound machine to make it completely evenly distributed.

[0051] 4. Brush the above prepared solution evenly on 18 layers of glass fiber cloth with a wool brush, and let it dry.

[0052] 5. Stack 18 layers of glass fiber cloth, and arrange 16 aluminum foil "ten" shapes in a 4×4 manner between the 5th and 6th layers, and place 1 aluminum foil in the middle of every 4 "ten" "Ten", place 13 aluminum foil "ten" between the 12th and 13th layers in the same arrangement.

[0053] 6. Arrange the laminated glass fiber on a flat...

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Abstract

The invention relates to a frequency selection surface microwave absorbing material and a preparation method thereof. The invention adopts multi-layer microwave absorbing coating composite technology, realizes the preparation of a broad band microwave absorbing coating, the microwave absorbing capability is improved, the process is simple, the operation is convenient, the equipment is simple, the investment is less, the cost is low, the method is applied to mass production, the obtained coating is thin, the cohesiveness is good, the thickness of the coating can be changed according to the microwave absorbing performance, generally, the thickness is 1 to 2 mm, the coating is even, and the coating has good microwave absorbing performance from 2 to 18 GHz.

Description

technical field [0001] The invention relates to a wave-absorbing material and a preparation method thereof, in particular to a frequency-selective surface wave-absorbing material and a preparation method thereof. Background technique [0002] With the development of high technology such as radar detection, satellite communication, aerospace and electronic countermeasures, especially in recent years, the research on electromagnetic wave absorbing materials has been paid more and more attention by researchers due to the aspects of anti-electromagnetic wave interference, stealth, microwave anechoic chamber and so on. Developed countries in the world have invested a lot of manpower and material resources in research in this area. In addition, with the rapid development of the modern electronics industry and information industry, electronic equipment (such as microwave ovens, mobile phones, televisions, and computers) that generate electromagnetic wave interference has increased ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/22B32B15/092B32B15/20B32B17/04B32B27/26B32B37/10B32B37/06B32B38/00H05K9/00
Inventor 朱红宋渊申闫春
Owner BEIJING UNIV OF CHEM TECH