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CN group-containing organosilane co-polymer modified cyanate ester resin and preparation method thereof

A technology for modification of cyanate ester resin and copolymer, which is applied in the field of polymer and its processing, can solve the problems of toughening, sacrificing heat resistance, and insignificant toughening effect, and achieve good dielectric properties and excellent heat resistance Properties and dielectric properties, the effect of good mechanical properties

Inactive Publication Date: 2011-09-14
JIANGSU LUOSHI DAMPING MEMBER CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods have their own disadvantages while toughening
Among them, the toughening effect of thermosetting resin modification is not significant, while thermoplastic and elastomer modification will sacrifice the heat resistance of the system
Organosilicon compounds, especially macromolecular organosilicon, have the characteristics of good heat resistance and excellent dielectric properties. They have shown many excellent properties in modifying epoxy resins, but there is no relevant organosilicon modification. Cyanate Resin Reports

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 100 parts of bisphenol A cyanate resin and 6 parts of CN group-containing organosilicon copolymer into acetone, and after being completely dissolved, heat and distill to remove the organic solvent. Pre-polymerize at 80-120°C, the pre-polymerization time is 10-50 minutes; then pour it into a preheated mold, vacuumize to remove air bubbles, and put it in an oven for curing. The curing temperature is controlled at 100-220°C, and the curing time is controlled at 6-12 hours. That is, the CN group-containing organosilicon copolymer modified cyanate resin is obtained.

Embodiment 2

[0030] Add 100 parts of cyclopentadiene-type cyanate resin and 8 parts of CN group-containing organosilicon copolymer into acetone, and after they are completely dissolved, heat and distill to remove the organic solvent. Pre-polymerize at 80-120°C, the pre-polymerization time is 10-50 minutes; then pour it into a preheated mold, vacuumize to remove air bubbles, and put it in an oven for curing. The curing temperature is controlled at 100-220°C, and the curing time is controlled at 6-12 hours. That is, the CN group-containing organosilicon copolymer modified cyanate resin is obtained.

Embodiment 3

[0032] Add 100 parts of bisphenol A cyanate resin and 10 parts of CN group-containing organosilicon copolymer into acetone, and after they are completely dissolved, heat and distill to remove the organic solvent. Pre-polymerize at 80-120°C, the pre-polymerization time is 10-50 minutes; then pour it into a preheated mold, vacuumize to remove air bubbles, and put it in an oven for curing. The curing temperature is controlled at 100-220°C, and the curing time is controlled at 6-12 hours. Promptly obtain the modified cyanate ester resin containing CN group organosilicon copolymer.

[0033] The performance index of the CN-based organosilicon copolymer modified bisphenol A type cyanate resin of the present invention is as follows:

[0034] Impact strength: >13KJ / m 2 ;Bending strength: >120Mpa;

[0035] Dielectric constant: <2.98; dielectric loss tangent Tanδ: <0.014;

[0036] Glass transition temperature: >250°C; initial thermal decomposition temperature: >410°C;

[0037] The t...

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Abstract

The invention relates to the modified ethylene rhodanate resin containing CN-based organic silicon copolymer and a preparation method thereof. The method has technical characteristics that the following steps are included: mixing 100 parts (by mass part) of ethylene rhodanate resin and 1-30 parts of CN-based organic silicon copolymer by a cosolvent method; distilling to remove the solvent; carrying out pre-polymerization; solidifying according to certain solidification technology to obtain the modified ethylene rhodanate resin containing CN-based organic silicon copolymer. Compared with the traditional ethylene rhodanate modification method, the method has good heat resistance owing to the fact that the organic silicon belongs to giant molecules; owing to the containing of the CN radical,the method can be dissolved in organic solvent and has good compatibility with the ethylene rhodanate resin, thereby remarkably improving the mechanical performance, heat performance and dielectric performance of the modification system. Furthermore, the modification system has favorable impact strength, bending strength and excellent heat resistance and dielectric performance, which can be used as the resin matrix of electronic encapsulating materials and wave-transparent composite materials.

Description

technical field [0001] The invention relates to a CN group-containing organic silicon copolymer modified cyanate resin and a preparation method thereof, belonging to the field of polymers and their processing. Background technique [0002] Cyanate resin has the advantages of excellent mechanical properties, high heat resistance, low water absorption, and more importantly, excellent dielectric properties. It is the preferred resin matrix for a new generation of electronic packaging materials and wave-transparent composite materials. But like other thermosetting resins, this resin also has a weak point of being brittle. At present, there are many toughening and modification methods for cyanate esters, mainly including copolymerization with thermosetting resins, blending with thermoplastics, and blending with elastomers. However, these methods have their own disadvantages while toughening. Among them, the toughening effect of thermosetting resin modification is not significan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G81/00B29C39/00C08G73/00C08F212/10
Inventor 颜红侠梁国正刘继三李朋博桑丽鹏
Owner JIANGSU LUOSHI DAMPING MEMBER CO LTD
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