Release film for manufacture of printed wiring plate
A technology for printed circuit boards and release films, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc. It can solve problems such as insufficient tight adhesion of protective films, circuit deformation, and damage to quality, and achieve excellent non-polluting properties , small environmental load, and the effect of improving the qualified rate of products
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Embodiment 1
[0082] The thermoplastic resin layer adopts a 100 μm thick ultra-high molecular weight polyethylene sheet produced by Shin Kogyo Co., Ltd., and the metal layer adopts 50 μm thick aluminum produced by Toyo Alminium Co., Ltd. to form a release film (I).
[0083] In the copolymer of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, the thermoplastic liquid crystal polymer with a melting point of 280°C is melt-extruded, and the longitudinal and transverse stretch ratios are controlled. At the same time, the blown film forming method is used to obtain A thin film with a film thickness of 50 μm and a melting point of 280° C. The obtained film was also placed in a hot air dryer at 260° C. for 3 hours to be heat-treated, whereby a film having a melting point of 290° C. was obtained. This film is used as the main film, and copper foil with a thickness of 18 μm is placed on the upper and lower sides of the main film, and the press temperature is 290 ° C, the press pressure is 4 MPa,...
Embodiment 2
[0088] As the resin layer, instead of the ultra-high molecular weight polyethylene sheet produced by Shin Kogyo Co., Ltd., a 130 μm thick ultra-high molecular weight polyethylene sheet produced by Yodogawa Hitec Co., Ltd. was used to obtain a release film (I). In the same manner as in Example 1, a flexible printed circuit board was obtained.
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