Magnetic control cathode assembly for cleaning one-dimensional linear plasma with high efficiency

Abstract

The invention relates to the technical field of a plasma magnetic control cathode and in particular to a one-dimensional linear plasma cleaning magnetic control cathode device with high efficiency. The device is characterized in that the top of an electrode contact of a cathode is connected with a hollow pipeline and the bottom of the electrode contact of the cathode passes through an upper wall of a vacuum cavity body and is then connected with an upper surface of a cathode of a linear metal plate in the vacuum cavity body. A shield cover is arranged between the vacuum cavity body and the cathode of the linear metal plate and the upper partof the shield cover is also connected with a gas inlet pipe of which the top is positioned outside the vacuum cavity body. The upward side outside the vacuum cavity body is provided with a magnetic coil device. Compared with the prior art, the device has convenient and simple structure and realizes surface cleaning processing with high plasma density, low power consumption and high uniformity; the adjustment of the electromagnetic field can ensure the adjustable density of the plasma generated by the cathode so as to ensure the flexible application; and due to the adoption of a one-dimensional linear structure by the cathode, the device occupies small space and has easy installation. Therefore, the whole device has low production cost and can implement a large-area continuous cleaning technique.

Description

[technical field]

[0001] The invention relates to the technical field of plasma magnetron cathodes, in particular to a high-efficiency one-dimensional linear plasma cleaning magnetron cathode device. [Background technique]

[0002] With the rapid development of today's technology, plasma technology has been widely used in many professional fields and is becoming more and more important. During the production of semiconductor devices and functional thin films, there are problems such as particle adhesion, adsorption of water vapor, surface oxidation, and contamination on the surface of materials and devices, which will lead to poor film adhesion and poor device performance. In order to solve the above problems, the surface needs to be cleaned. Generally, the widely used physical and chemical cleaning methods can be roughly divided into two categories: wet cleaning and dry cleaning. Wet cleaning generally uses acid and alkali solutions to clean the surface of the substrate. ...

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