Method and system for reducing semiconductor chip particle contamination

Abstract

The invention discloses a method for reducing the particulate pollution of a semiconductor substrate, and a system thereof, pertaining to the field of semiconductor processing and manufacture. The method includes the steps that a semiconductor substrate is transferred to a substrate transfer station by an atmospheric mechanical arm; particles adsorbed on the surface of the semiconductor substrate are adsorbed and removed by an electrostatic field generating device; the adsorbed and removed particles are blown away by an air filtering and distributing device; and the semiconductor substrate is removed out of the substrate transfer station by the atmospheric mechanical arm. The system comprises the atmospheric mechanical arm, the substrate transfer station, the air filtering and distributing device, an ion generator and the electrostatic field generating device. In the invention, the electrostatic field generating device is added at the atmospheric end of a transfer system to control the adsorption mode of the particles of the semiconductor substrate so as to effectively reduce the particulate pollution during the transfer process of the semiconductor substrate and improve the rate of finished semiconductor substrate.

Description

technical field [0001] The invention relates to the field of semiconductor processing and manufacturing, in particular to a method and system for reducing particle pollution of semiconductor substrates. Background technique [0002] During the moving process of the semiconductor substrate, an atmospheric manipulator is usually used to move the semiconductor substrate from the atmospheric end of the transport system to the vacuum reaction chamber. In order to reduce the particle pollution of the semiconductor substrate during the moving process, the general method is to achieve the purpose of particle control by reducing the particle adhesion at the atmospheric end of the transmission system. Clean air is introduced into the atmospheric end of the transmission system at a certain wind speed, and an ion generator is installed at the atmospheric end of the transmission system. The principle of reducing the particle pollution of the semiconductor substrate by using the above tw...

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Problems solved by technology

[0003] However, the method of controlling the airflow has a more obvious effect on the particles attached due to gravity, but the effect on the particles a

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