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Manufacturing methods for metal clad laminates

A technology of metal-clad laminates and manufacturing methods, which is applied in the direction of metal layered products, metal material coating technology, metal pattern materials, etc., and can solve problems such as no solution for pattern printing methods

Active Publication Date: 2009-09-02
INKTEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to print thin and uniform patterns using existing technologies, and the patent does not provide a specific solution for the pattern printing method

Method used

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  • Manufacturing methods for metal clad laminates
  • Manufacturing methods for metal clad laminates
  • Manufacturing methods for metal clad laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] 2-Ethylhexylammonium 2-ethylhexylcarbamate (1.53kg, 5.08mol) and n-butylammonium n-butylcarbamate (1.33kg, 6.94mol) were added to a reactor equipped with a stirrer, and iso Propanol (0.95 kg) to dissolve them. Silver oxide (1 kg, 4.31 mol) was then added to the reactor and reacted at room temperature. A black slurry of the reaction solution appeared at the beginning of the reaction. However, since complexes were formed over time, it was observed that the color of the reaction solution became lighter and eventually became transparent. After reacting for 2 hours, a colorless transparent solution was obtained. To the solution were added 1-amino-2-propanol (0.125 kg) and acrylic resin VAP MP 200 (0.12 kg; manufactured by Chokwang Paint, Ltd.) as a stabilizer and a binder resin, respectively. After stirring, the solution was filtered using a membrane filter with a pore size of 0.45 μm to obtain a silver coating composition. Then, a polyimide (PI) film was coated with the...

Embodiment 2

[0101] The silver-coated film obtained in Example 1 was placed in a bath having nickel sulfate (150 g / L), nickel chloride (40 g / L) and boric acid (30 g / L) therein at 30°C. With nickel as the anode and the silver-coated side of the film as the cathode, a current (25 A / m 2 ) to prepare a metal-clad laminate with a 5-micron thick copper foil layer. The initial peel strengths of the metal-clad laminates prepared as above are given in Table 1 below.

Embodiment 3

[0103] A PET film was coated with the silver coating composition obtained in Example 1 above using a roll-to-roll coater. The film was then heat-treated to obtain a silver film having an electrical conductivity of 0.3 Ω / □ and a thickness of 0.2 µm. The conductive PET film thus obtained was placed in a bath having copper sulfate (125 g / L) therein at 35°C. With copper as the anode and the silver-coated side of the film as the cathode, a current (30 A / m 2 ) to prepare a metal-clad laminate with a 10-micron thick copper foil layer. The initial peel strengths of the obtained metal-clad laminates are given in Table 1 below. The metal-clad laminate prepared as above was subjected to photolithography treatment to form a mesh pattern with a line width of 10 microns and a line pitch of 300 microns.

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Abstract

The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating materialThe present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating materialusing the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, wh using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost.ich has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost.

Description

technical field [0001] The present invention relates to a method of manufacturing a metal clad laminate by using a silver coating composition containing a structurally unique silver complex on one or both sides of a material film made of an insulating material A conductive layer is formed, and a metal is plated on the outside of the conductive layer to manufacture a metal-clad laminate. In addition, the present invention also relates to a method of manufacturing a metal-clad laminate by forming a conductive pattern layer by directly printing a silver coating composition on a material when forming the conductive layer, and by forming a silver coating composition on the conductive pattern. The outside of the layer is electroplated with metal to produce a low resistance metal pattern layer. Background technique [0002] With the rapid development of the entire industry and technology in recent years, semiconductor integrated circuits have been significantly developed in common...

Claims

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Application Information

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IPC IPC(8): B32B15/08
CPCC09D5/24C23C18/08C23C18/1233C23C28/02C25D5/54H05K1/09
Inventor 郑光春赵显南严圣镕
Owner INKTEC CO LTD