Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for environment-friendly utilization of copper-nickel-tungsten alloy

A tungsten alloy and waste technology, applied in the field of environmental protection utilization of copper-nickel-tungsten alloy, can solve the problems of difficult treatment, waste liquid discharge pollution, low utilization rate, etc., and achieve the effect of high social and economic benefits and no environmental pollution.

Inactive Publication Date: 2009-09-09
丁四宜 +1
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]Copper-nickel-tungsten alloys, especially hard alloy tools such as cutting tools and drilling tools, are generally recycled after being used, such as as The utilization rate of fillers added to related steel refining is low; electronic waste, especially electronic circuit boards, contains precious metal copper, and hydrochloric acid is widely used to dissolve them, and the copper ions in the solution are recovered and returned to the acidic waste liquid. Contains valuable copper ions. This kind of waste liquid is difficult to handle. If it is not handled well, it will become waste liquid discharge and cause pollution.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for environment-friendly utilization of copper-nickel-tungsten alloy
  • Method for environment-friendly utilization of copper-nickel-tungsten alloy
  • Method for environment-friendly utilization of copper-nickel-tungsten alloy

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0026] Follow the steps below:

[0027] 1. In the rotary drum reactor, add copper-nickel-tungsten-containing waste and sodium chloride to the waste acid etching solution containing copper chloride, heat to 80°C, wait until the solution turns dark brown and then detect: Take a sample of 10ml and pour it into 50ml of water to form a white precipitate, and the copper ion content in the supernatant on the precipitate is detected <0.01%. At this time, the reaction is stopped, and the mixed solution after the reaction is filtered. The filter residue is metal tungsten containing a small amount of impurities; the filter residue is dried After dry recovery, it is a tungsten powder product with a tungsten content of more than 95%. The filtrate is a solution containing copper ions, nickel ions, manganese ions and iron ions.

[0028] 2. Copper separation, the filtrate in the previous step is adjusted to a pH value of 3.5 with sodium hydroxide, and air is introduced at 45°C until the copp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for environment-friendly utilization of copper-nickel-tungsten alloy. Sodium chloride and acid waste etching solution containing copper ions are added into alloy scraps; indissoluble tungsten and copper ion deposition is recycled after scraps are dissolved to recycle copper; the iron and manganese ions are removed, and nickel is recycled from nickel ion deposition, thereby the precious copper, nickel, tungsten are recycled from alloy scraps and copper is recycled from waste etching solution, and the environment-friendly treatment of waste etching solution is realized. The invention has the advantages that the precious copper, nickel and tungsten are recycled from copper-nickel-tungsten alloy scraps, and the acid waste etching solution containing copper ions from the treatment of electronic products scraps can be utilized without environment pollution; furthermore, the production process is environment-friendly, therefore the invention has high social and economic benefits.

Description

technical field [0001] The invention relates to an environment-friendly recovery method for scrap metal, in particular to an environment-friendly utilization method for waste copper-nickel-tungsten alloy. Background technique [0002] Copper-nickel-tungsten alloys, especially cemented carbide tools such as knives and drilling tools, are generally recycled after being used and recycled. For example, they are added as fillers to refining related steels, and their utilization rate is low; Electronic waste, especially electronic circuit boards containing precious metal copper, is currently widely used to dissolve it with hydrochloric acid. After recovering the copper ions in the solution, the acidic waste liquid also contains valuable copper ions. This kind of waste liquid is difficult to handle. If it is not handled well, it will become waste liquid discharge and cause pollution. Contents of the invention [0003] The object of the present invention is to provide an environm...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B15/00C22B23/00C22B34/36
CPCY02P10/20
Inventor 王水平丁四宜
Owner 丁四宜
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com