Lid for functional part and process for producing the same
A manufacturing method and component technology, applied in manufacturing tools, semiconductor/solid-state device parts, electrical components, etc., can solve problems such as problems with brazing, poor brazing, and inability to join, and achieve simple manufacturing, improved bonding strength, The effect of ensuring wettability
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[0063] The manufacturing method of the cap of the present invention is carried out in the method shown in the drawings.
[0064] Figure 1~4 Each process in the manufacturing method of the cap of this invention is demonstrated.
[0065] An example of the lid material sheet used in the manufacturing method of the lid of this example, the plating of the lid, and the solder paste is as follows.
[0066] Cover material plate: Kovar alloy (thickness 0.1mm, width 40mm long shape)
[0067] Plating of the cover material plate: Ni substrate (thickness 0.1 μm), Sn plating (thickness 3 μm), implemented by electroless plating.
[0068] solder paste
[0069] Pure Cu powder (Cu-based metal powder): 27% by mass (average particle size 7 μm)
[0070] Pure Sn powder (lead-free solder powder): 63% by mass (average particle size 10μm)
[0071] Flux: 10% by mass
[0072] Flux composition
[0073] Resin (polymerized rosin) 56% by mass
[0074] Active agent (diphenyl guanidine) 1% by mass
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