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Method for applying conducting polymer to nonmetallic surface electroplating

A conductive polymer, non-metallic surface technology, applied in the field of conductive polymer, non-metallic surface electroplating, can solve problems such as the inability to meet special application fields, and achieve the effect of controllable resistance and simple operation

Inactive Publication Date: 2009-09-16
宁连才
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem that above-mentioned technique exists is: (1) the conductive layer of coating is difficult to all have very strong adhesion with various non-metallic surfaces, thereby can not all form good coating on all non-metallic surfaces; (2) It cannot meet the requirements of special application fields, such as thinner conductive layer, narrower width of conductive layer, transparent conductive layer, controllable surface resistance of conductive layer, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Taking gold plating on the surface of plastic as an example, the specific implementation of procedure 1 is described in detail:

[0029] First, the plastic product surface is coated with a sizing glue, which is a mixture of ABS paint and a solvent; after the sizing glue dries out, the plastic product is impregnated with a mixture of 3,4-ethylenedioxythiophene monomer and ethanol, 3,4-ethylene dioxythiophene The volume ratio of oxythiophene monomer to ethanol is 1:5, the impregnation time is 2 minutes, and the impregnation method is atmospheric pressure impregnation; after the plastic products are impregnated with 3,4 ethylenedioxythiophene monomer, they are dried at 60°C and dried The time is 60 minutes; after the plastic is dried, the product is impregnated with a mixture of iron p-toluenesulfonate and n-butanol, the mass percentage of iron p-toluenesulfonate in n-butanol is 50%, the impregnation time is 5 minutes, and the impregnation method is reduced pressure Impreg...

Embodiment 2

[0031] Taking the electroplating imitation gold on the surface of ceramics as an example, the specific implementation of procedure two is described in detail:

[0032]First, the surface of the ceramic product is coated with a sizing glue, which is a mixture of ABS paint and a solvent; after the sizing glue dries out, the ceramic product is impregnated with 3,4-ethylenedioxythiophene monomer, p-toluenesulfonate iron initiator, ethanol The mixture, the molar ratio of 3,4-ethylenedioxythiophene to iron p-toluenesulfonate is 1:2.3, the mass percentage of initiator and solvent is 50%, the impregnation time is 3 minutes, and the impregnation method is vacuum impregnation; After the product is impregnated with the initiator, it is dried at 105°C for 5 hours. After drying, the ceramic with the conductive polymer is immersed in the electroplating imitation gold plating solution, and the surface of the ceramic containing the conductive polymer is used as the cathode. Electroplating with...

Embodiment 3

[0034] (3) Taking copper electroplating on the surface of the printed circuit board substrate as an example to describe the specific implementation of procedure three:

[0035] Firstly, the sizing glue is coated on the surface of the printed circuit board substrate, and the sizing glue is a mixture of ABS paint and solvent; after the sizing glue dries, the printed circuit board substrate is impregnated with poly 3,4-ethylenedioxythiophene: polystyrene sulfonate (PEDOT : PSS), a mixture of ethanol, poly 3,4-ethylenedioxythiophene: polystyrene sulfonate (PEDOT: PSS) and ethanol volume ratio of 1:5, dipping time is 1 minute; printed circuit board substrate dipping Dry the conductive polymer at 125°C for 45 minutes. After drying, immerse the printed circuit board with the conductive polymer in the electroplating copper bath, and cover the surface of the printed circuit board with the conductive polymer. As the cathode, the titanium plate is used as the anode for electroplating, an...

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PUM

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Abstract

The invention discloses a method for applying conducting polymer to nonmetallic surface electroplating, which comprises the following steps: firstly, coating sizing adhesive on the surface of a product, soaking the product in a mixture of a monomer and a solvent after the sizing adhesive is dry, drying the product soaked in the mixture of the monomer and the solvent, soaking the dried product in a mixture of an initiating agent and the solvent, drying the product soaked in the mixture of the initiating agent and the solvent to generate the conducting polymer, and finally, electroplating metal on the conducting polymer. After the surface of the product is coated with the sizing adhesive, the product can also be directly soaked in a mixture of the monomer, the initiating agent and the solvent, then the soaked product is dried to generate the conducting polymer, and finally the metal is electroplated on the conducting polymer. After the surface of the product is coated with the sizing adhesive, the product can also be directly soaked in a mixture of the conducting polymer and the solvent, then the soaked product is dried to generate the conducting polymer, and finally the metal is electroplated on the conducting polymer. The sizing adhesive is a mixture of ABS paint and solvents. Because the paint has strong adhesion force with various nonmetallic surfaces, good plating layers can be formed on all nonmetallic surfaces after electroplating. The method is simple to operate and suitable for large-scale production; and the nonmetallic surface electroplating is electroplating on various nonmetallic products such as printed circuit substrates, plastics, ceramics, plaster, clay pottery, cement, tiles, stones, artificial stones, animals, plants and the like.

Description

technical field [0001] The invention relates to the technical field of electroplating on non-metal surfaces, in particular to a method for using conductive polymers for electroplating on non-metal surfaces. Background technique [0002] At present, the electroplating process of non-metallic surfaces such as plastics, ceramics, and printed circuit board substrates is complicated, and generally requires steps such as cleaning, degreasing, roughening, sensitization, activation, chemical plating, pre-plating, and electroplating. Many, so the process control is difficult, and it is difficult to ensure the uniformity and stability of the product. The Japanese Zhao 55-79871 patent describes the use of carbon particles or silver, copper, nickel powder mixed with organic binders and organic solvents to form a fluid suspension, which is coated on non-metallic materials to form a conductive layer, and then electroplated. method. Japanese flat 1-301882 patent introduces a method of co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/54
Inventor 宁连才
Owner 宁连才