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Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof

A technology for thermal insulation decorative panels and metal surfaces, which is applied to surface layering devices, manufacturing tools, building structures, etc., can solve the problems of low flexural strength of panels, poor surface decoration, and high flexural strength costs, and achieve easy On-site processing and installation, high cost performance and fast construction

Inactive Publication Date: 2009-09-16
HUBEI MEIHENG NEW KEEP WARM DECORATION MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The building exterior wall insulation system currently in use (EPS board, XPS board external plastering technology and thermal insulation coating technology) has complex construction technology, wet work on site, long construction period, heavy insulation layer weight, increased building load, and surface decoration. Not good, there are disadvantages such as easy foaming, cracking, water seepage, and short service life
There is also a composite exterior wall insulation material with aluminum alloy as the panel and polystyrene extruded board as the bottom plate. Although it solves the problem of wet construction on site, the construction speed is high and the surface decoration is good, but due to this The extruded polystyrene board (XPS) base plate of the material is exposed and the fire performance is extremely poor. Another disadvantage of the material is that the aluminum alloy panel is directly bonded to the polystyrene board, so the bonding strength is not high

Method used

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  • Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof
  • Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof
  • Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof

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Experimental program
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Embodiment Construction

[0022] refer to figure 1 , the upper layer 2 of the cast-in-place integrated core base plate of the thermal insulation decorative board of the present invention has a metal plate decorative surface layer 1, and there is a core column 3 between the upper layer 2 and the lower layer 5 of the cast-in-place integral core base plate. There is a foam insulation board 4 with holes between the column 3 and the upper and lower layers of the cast-in-place integrated core base plate. The upper layer and the core column 3 of the cast-in-place integral core base plate and the XPS insulation board 4 are combined into a cast-in-place integral core base plate, on which a metal plate decorative surface layer 1 is pasted to form a thermal insulation decorative plate. The foam insulation board 4 with holes is an extruded polyvinyl chloride insulation board, phenolic foam board, polyurethane foam board, EPS board or expanded glass bead forming board.

[0023] The thickness of the thermal insulat...

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PUM

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Abstract

The invention relates to a metal faced integral-linking chip substrate insulated and decorated board and a manufacturing method thereof. The uppermost layer of the cast-in-situ molding integral-linking chip substrate board is a decorated surface of metal plate, a button stem is installed between the upper and the lower layers of the integral-linking chip substrate board, foaming insulation boards with holes are between the button stem and the upper and lower layers of the cast-in-situ molding integral-linking chip substrate board, and the holes are used for forming the button stem. The preparation method is as follows: a steel bracket, a template and a mould are displaced on a vibration workbench, sizing agent is applied for the first time and the steel bracket, the template and the mould are put into the foaming insulation boards, the holes for forming the button stem are between the foaming insulation boards, sizing agent is applied for the second time, a cast-in-situ molding internal-linking substrate board is formed, the upper-layer fiber mesh and non-woven fabrics are paved smoothly, static maintenance and white-hard drying are carried out, the metal decorated board is pressed, bonded, and is edge-molded. The insulated decorated board has quick site operation, easy processing and mounting in site, light weight, high integrated intensity, good insulation performance, good weather resistance, good surface decorative performance, and difficult ablation among layers.

Description

technical field [0001] The invention relates to a heat-preservation decorative board with a metal surface layer integrated core-base base and a manufacturing method thereof. Background technique [0002] The building exterior wall insulation system currently in use (EPS board, XPS board external plastering technology and thermal insulation coating technology) has complex construction technology, wet work on site, long construction period, heavy insulation layer weight, increased building load, and surface decoration. Not good, there are disadvantages such as easy foaming, cracking, water seepage, and short service life. There is also a composite exterior wall insulation material with aluminum alloy as the panel and polystyrene extruded board as the bottom plate. Although it solves the problem of wet construction on site, the construction speed is high and the surface decoration is good, but due to this The extruded polystyrene board (XPS) base plate of the material is expos...

Claims

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Application Information

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IPC IPC(8): E04F13/075B28B1/087B28B19/00B28B11/00
Inventor (请求不公开姓名)
Owner HUBEI MEIHENG NEW KEEP WARM DECORATION MATERIALS
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