Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof
A technology for thermal insulation decorative panels and metal surfaces, which is applied to surface layering devices, manufacturing tools, building structures, etc., can solve the problems of low flexural strength of panels, poor surface decoration, and high flexural strength costs, and achieve easy On-site processing and installation, high cost performance and fast construction
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[0022] refer to figure 1 , the upper layer 2 of the cast-in-place integrated core base plate of the thermal insulation decorative board of the present invention has a metal plate decorative surface layer 1, and there is a core column 3 between the upper layer 2 and the lower layer 5 of the cast-in-place integral core base plate. There is a foam insulation board 4 with holes between the column 3 and the upper and lower layers of the cast-in-place integrated core base plate. The upper layer and the core column 3 of the cast-in-place integral core base plate and the XPS insulation board 4 are combined into a cast-in-place integral core base plate, on which a metal plate decorative surface layer 1 is pasted to form a thermal insulation decorative plate. The foam insulation board 4 with holes is an extruded polyvinyl chloride insulation board, phenolic foam board, polyurethane foam board, EPS board or expanded glass bead forming board.
[0023] The thickness of the thermal insulat...
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