Silicon nitride ceramic ball preparation method employing glass encapsulating heat and other static pressuring processes
A technology of silicon nitride ceramic balls and hot isostatic pressing, which is applied in the field of engineering ceramics preparation, can solve the problems of small improvement of microstructure, irreparable and incomplete elimination of large-sized cracks and pores, and easy operation. , Conducive to production, good repeatability
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Embodiment 1
[0024] The silicon nitride formulation (95%Si 3 N 4 +3wt%Y 2 o 3 +2wt%Al 2 o 3 ) into a ceramic ball green body of φ5mm, cold isostatic pressing is carried out under a pressure of 200 MPa, and the density of the green body reaches 60% of the theoretical density, and then a layer of colloidal graphite isolation layer is coated on the surface by a solution impregnation method, and the thickness is greater than 0.05 mm, put it into a graphite crucible after fully drying, embed borosilicate cullet around it, then heat up to 1200°C, the glass melts, completely encapsulate silicon nitride balls, pressurize and heat up to 1850°C, 200MPa, heat preservation and pressure Hot isostatic pressing sintering was carried out for 2 hours, and after the sintering was completed, the temperature was lowered under control, and the silicon nitride balls were taken out.
[0025] The φ5mm silicon nitride ball prepared by the above process has a uniform microstructure, no pores, cracks and other ...
Embodiment 2
[0027] The silicon nitride formulation (95% Si 3 N 4 +3wt%Y 2 o 3 +2wt%Al 2 o 3 ) into ceramic balls of φ7mm, the batch size is 2kg, and the pressure is kept at 200MPa for 5 minutes for cold isostatic pressing, and then the green body is coated with a layer of colloidal graphite isolation layer on the surface by solution impregnation method, the thickness is greater than 0.05mm, and fully dried Then put it into a graphite crucible, embed borosilicate broken glass around it, then heat up to 1200°C, the glass melts, completely encapsulate the silicon nitride ball, pressurize and heat up to 1850°C, 200MPa, heat and hold the pressure for 2 hours. Isostatic sintering, after the sintering is completed, the temperature is lowered under control, and the silicon nitride balls are taken out.
[0028] The φ7mm silicon nitride balls prepared in batches by the above process have a uniform microstructure, no pores, cracks and other defects, and a microhardness of 1550kg / mm 2 , indenta...
Embodiment 3
[0030] The silicon nitride formulation (92%Si 3 N 4 +5wt%Y 2 o 3 +3wt%Al 2 o 3 ) into ceramic balls of φ16mm, hold the pressure at 200MPa for 5 minutes for cold isostatic pressing, and then use the solution impregnation method to coat a layer of colloidal graphite isolation layer on the surface, the thickness is greater than 0.1mm, and put it into a graphite crucible after fully drying Borosilicate broken glass is embedded inside and around, and then the temperature is raised to 1200 ° C, the glass is melted, and the silicon nitride ball is completely encapsulated, and the temperature is increased to 1850 ° C, 180 MPa, and the heat preservation and pressure are held for 2 hours for hot isostatic pressing sintering. After the sintering is completed, the silicon nitride ball is taken out by controlling the temperature drop.
[0031] The φ16mm silicon nitride ball prepared by the above process has a uniform microstructure, no pores, cracks and other defects, and a microhardn...
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