High-efficiency radiating LED illumination light source and manufacture method

Abstract

The invention discloses a high-efficiency radiating LED illumination light source with low cost, good radiating effect, high production efficiency and high manufacture precision and a manufacture method. The high-efficiency radiating LED illumination light source comprises LED bare chips (1) and a metal substrate (2), wherein a heat conduction insulating layer is deposited on the metal substrate (2); metal layers (6) are deposited on the heat conduction insulating layer; the metal layers (6)are covered by a welding prevention layer (8); the heat conduction insulating layer is combined by a silicon dioxide layer (30) or a silicon nitride (31) or the combination of the silicon dioxide layer (30) and the silicon nitride (31); a preset circuit connection and a preset figure are formed on each metal layer (6) according to the serial connection and parallel connection relation of the LED bare chip (1); the LED bare chips (1) are divided into a plurality of groups and are mounted on each metal layer (6) normally or inversely; and the LED bare chips (1) in each group and the LED bare chips in the plurality of groups are connected through the metal layers (6) to form circuits. The manufacture method comprises the steps of pretreatment of the metal substrate, formation of the heat conduction insulating layer, the metal layers and the welding prevention layer as well as the encapsulation of the LED bare chips.

Description

technical field [0001] The invention relates to a high-efficiency heat dissipation LED lighting source; in addition, the invention also relates to a manufacturing method of the high-efficiency heat dissipation LED lighting source. Background technique [0002] Integrating multiple LED bare chips on a circuit board is called an integrated chip. Whether it is a single-electrode LED bare chip, a double-electrode LED bare chip or a flip-chip LED bare chip, it can be applied to an LED integrated chip. Aluminum substrates are often used in LED integrated chips. The existing lighting LED aluminum substrates use metal aluminum or aluminum alloy as a substrate, coated with an organic or inorganic thermally conductive insulating layer, and then covered with copper foil on the thermally conductive insulating layer. It is widely used in the field of LED because of its heat-conducting insulation layer can withstand high voltage (>1500V / min) and the substrate has better heat dissipati...

AI Technical Summary

Problems solved by technology

The manufacturing process of this kind of integrated LED chip light source needs to first package the LED bare chip first, and then perform secondary packaging on the aluminum substrate with circuit, so the process is complicated, the cost is high, and the production efficiency is low.

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