Reacting chamber and plasma processing system with same

A reaction chamber and chamber technology, applied in the field of microelectronics, can solve the problems affecting the processing/processing results of workpieces, process yield rate, pumping speed, affecting workpiece processing/processing results, and affecting process yields, etc., to avoid Airflow reflection and turbulence, reduced pumping time, effect of reduced pumping time
CN101640165AInactive Publication Date: 2010-02-03BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Publication Date
2010-02-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a reacting chamber. The chamber is provided with a vacuum pump port connected with a vacuum pump, and is provided with a guide part corresponding to a turning position in the chamber, wherein the shape and the arrangement direction of the guide part conform to the air flow direction in the chamber for reducing and even preventing air flow in the chamber from generating reflection and onflow phenomenon. Furthermore, the invention also provides a plasma processing system with the reacting chamber. The reacting chamber and the plasma processing system can reduce and even avoid particulate pollution in the chamber so as to improve the manufacturing / processing quality of a workpiece, technical yield and air exhaust velocity.
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Description

technical field

[0001] The invention relates to the technical field of microelectronics, in particular, to a reaction chamber and a plasma processing system with the reaction chamber. Background technique

[0002] With the rapid development of electronic technology, people have higher and higher requirements for the integration of integrated circuits, which requires companies that produce integrated circuits to continuously improve the processing / processing capabilities of semiconductor devices. Currently, plasma processing techniques such as plasma deposition techniques, plasma etching techniques, and the like are widely used in the processing / processing of semiconductor devices. These plasma processing technologies usually need to be realized by means of corresponding plasma processing systems.

[0003] Generally, a reaction chamber for providing a vacuum environment is provided in the above-mentioned plasma processing system. In practical applications, in order to obtai...

Claims

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