Material composition of halogen-free printed circuit board with low dielectric loss and manufacturing method thereof

Abstract

The invention discloses material composition of a halogen-free printed circuit board with low dielectric loss and a manufacturing method thereof, which are applied to the manufacturing environment ofa substrate material of the printed circuit board. The material composition of the halogen-free printed circuit board with the low dielectric loss mainly comprises a phosphor-containing phenolic resintaken as a crosslinking agent; and the crosslinking agent can make the substrate material of the printed circuit board pass a UL 94-0 flame retardant test, can also make phosphor combined with the material into a material structure to eliminate the worry of precipitation, and can be matched with a resin with low dielectric loss characteristic and inorganic powder so as to reduce the dielectric constant and the dielectric loss of the material. The material composition of the halogen-free printed circuit board with the low dielectric loss has the advantages of low dielectric loss characteristic, heat resistance and low expansibility, and can also meet the requirement of no lead solder to meet the requirements of the market and environmental protection at the same time.

Description

technical field [0001] The invention relates to a composition and a manufacturing method of a printed circuit board material, in particular to a composition and a manufacturing method of a halogen-free printed circuit board material with low dielectric loss. Background technique [0002] For the FR-4 copper foil substrate material in the prior art, its flame retardant element is mainly bromine, however, because the substrate material containing bromine as the flame retardant element burns, there will be a large amount of black smoke, And the release of stench, and suitable release of harmful substances. Therefore, in order to meet the requirements of environmental protection regulations, the demand for halogen-free copper foil substrate materials is also increasing day by day. At the same time, in the signal transmission of the circuit, the system industry is constantly demanding faster signal transmission time, and at the same time can obtain a clearer signal, and due to th...

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Problems solved by technology

[0003] For the prior art, for example, the invention bulletin / publication number I290160 of the Taiwan Patent Gazette is a halogen-free flame-retardant epoxy resin composition, a halogen-free flame-retardant epoxy resin composition for a combined multilayer board, and a preliminary Dipping material, copper-lined laminate, printed wiring board, resin film with copper foil, resin film with carrier, composite laminate, and composite multilayer board, invention announcement / publication number I289571 halogen-free Phosphide flame retardant thermosetting polymer material composition, although it is a halogen-free laminate material formula, but the above patents only have the "halogen-free" function, but do not have low dielectric constant and low dielectric loss characteristics; in addition, the U.S. Patent US7273900 case, although it has low dielectric constant and low dielectric loss characteristics, however, this patent uses bromine and phosphorus-containing flame retardants as additives, and is not combined with the structure of the substrate material Among them, yes, this will cause the pollution of the environment caused by the precipitation of flame retardants

[0004] Therefore, for the prior art, if it wants to meet the function of halogen-free, it cannot have low dielectric constant and low dielectric loss characteristics; however, if it is required to have low dielectric constant and low dielectric loss characteristics, then There is a problem of polluting the environment

Therefore, it is impossible to simply combine the above-mentioned prior art patents to achieve the halogen-free function and the requirements of low dielectric constant and low dielectric loss characteristics, but must seek other technical means to solve the problem

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