Modified epoxy resin adhesive and preparation method thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, adhesive, carboxyl rubber adhesive, etc., can solve the problems of high brittleness, and achieve the effects of improving flexibility, convenient use, and simple synthesis process

Active Publication Date: 2010-02-24
ZHONGSHAN DONGYI HIGH TECH MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, epoxy resin adhesives also have some shortcomings, that is, they are rel

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The present embodiment modified epoxy resin adhesive comprises the following components by weight:

[0039] Brominated epoxy resin 10 parts

[0040] Hydrogen-terminated nitrile rubber 20 parts

[0041] 0.2 parts of 1,4-phenylenediamine

[0042] 2 parts silicon dioxide

[0043] Acetone 20 parts

[0044] The preparation method of modified epoxy resin adhesive of the present invention, it may further comprise the steps:

[0045] a, the preparation of toughening agent: cut 20 parts of solid hydrogen-terminated nitrile rubber, wherein the content of acrylonitrile in the hydrogen-terminated nitrile rubber is 18-41%, weigh 10 parts in the reaction kettle Acetone, turn on the agitator, add small pieces of hydrogen-based nitrile rubber according to the proportion; fully stir until completely dissolved into a uniform and transparent solution;

[0046] b. Preparation of adhesive: Weigh 10 parts of acetone in another reaction kettle, turn on the agitator, and add the toughenin...

Embodiment 2

[0049] The present embodiment modified epoxy resin adhesive comprises the following components by weight:

[0050] Bisphenol A type epoxy resin 50 parts

[0051] 80 parts of amino-terminated nitrile rubber

[0052] Diaminodiphenyl ether 5 parts

[0053] Titanium dioxide 15 parts

[0054] Butanone 80 parts

[0055] The preparation method of modified epoxy resin adhesive of the present invention, it may further comprise the steps:

[0056] a, the preparation of toughener: 80 parts of solid amino-terminated nitrile rubbers are cut into pieces, and the content of acrylonitrile in the wherein said amino-terminated nitrile rubber is 18-41%, takes by weighing 40 parts of butanone in the reactor, Turn on the agitator and add small pieces of amino-butadiene rubber according to the ratio; stir fully until it completely dissolves into a uniform and transparent solution;

[0057] b. Preparation of adhesive: Weigh 40 parts of butanone in another reaction kettle, turn on the agitator, ...

Embodiment 3

[0060] The modified epoxy resin adhesive of this embodiment includes the following components by weight:

[0061] Bisphenol F type epoxy resin 14 parts

[0062] Carboxyl-terminated nitrile rubber 30 parts

[0063] Diaminodiphenylsulfone 0.4 parts

[0064] Imidazole 0.02 parts

[0065] Surfactant 0.0005 parts

[0066]Aluminum hydroxide 2.5 parts

[0067] 25 parts of ethylene glycol methyl ether

[0068] The preparation method of modified epoxy resin adhesive of the present invention, it may further comprise the steps:

[0069] a, the preparation of toughening agent: 30 parts of solid carboxyl-terminated nitrile rubbers are cut into pieces, and the content of acrylonitrile in the carboxyl-terminated nitrile rubber is 18-41%, and 13 parts of ethylene glycol are weighed in the reactor Methyl ether, turn on the agitator, add small pieces of carboxyl-terminated nitrile rubber according to the proportion; fully stir until completely dissolved into a homogeneous transparent solu...

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PUM

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Abstract

The invention discloses a modified epoxy resin adhesive, which comprises the following components in portion by weight: 10 to 50 portions of epoxy resin, 20 to 80 portions of toughening agent, 0.2 to 5 portions of curing agent, 0 to 2 portions of curing accelerant, 0 to 1 portion of assistant, 2 to 15 portions of inorganic filler and 20 to 80 portions of solvent. In order to overcome the defects in the prior art, the invention provides the modified epoxy resin adhesive with strong flexibility, high peeling strength, good flexure property, good size stability, strong chemical corrosion resistance and excellent electric performance, and a method for producing the modified epoxy resin adhesive.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof, in particular to a modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] Flexible printed circuit board (FPC) is a new type of wiring method in the printed circuit industry of the electronics industry. Compared with rigid printed circuit boards, FPC can be bent, folded and connected, and it can be three-dimensionally wired, connected in three-dimensional space, and reduced in weight. Volume; it makes electronic products develop in the direction of high density, miniaturization and high reliability. At present, it is widely used in many electronic product fields such as communication equipment, computer, camera, automobile industry, weapon industry, instrumentation industry and so on. The FPC base material is formed by bonding flexible insulating materials and copper foils with adhesives through hot pressing. The adhesives used include polyest...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J109/02C09J113/00H05K3/38
Inventor 陈剑民王伟来育梅
Owner ZHONGSHAN DONGYI HIGH TECH MATERIAL
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