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Polyimide material, preparation method thereof, metal laminate plate containing same and preparation method of metal laminate plate

A polyimide and metal layer technology, applied in the field of metal laminates and its preparation, can solve the problems of poor adhesive performance between resin and metal foil, large dimensional changes, obvious hygroscopic expansion effect, etc., and achieve excellent dimensional stability , good combination effect

Inactive Publication Date: 2010-03-03
BYD CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, when the FCCL prepared by this method is processed into thin wires, the hygroscopic expansion effect is obvious, and the size changes greatly, which leads to the problem of poor line connection.
Another prior art discloses a laminate for circuit boards. In its technical solution, a polyimide with improved hydrophobicity and low hygroscopicity is introduced into the polyimide resin system by introducing a fluorine-based resin. However, the preparation cost of this method is high, the adhesive performance between the resin and the metal foil is poor, and the thermal dimensional stability is significantly reduced.

Method used

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  • Polyimide material, preparation method thereof, metal laminate plate containing same and preparation method of metal laminate plate
  • Polyimide material, preparation method thereof, metal laminate plate containing same and preparation method of metal laminate plate
  • Polyimide material, preparation method thereof, metal laminate plate containing same and preparation method of metal laminate plate

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preparation example Construction

[0033] The invention provides a method for preparing a polyimide material. The method comprises mixing and reacting an aromatic tetra-acid dianhydride and an aromatic diamine in a solvent to obtain a polyamic acid, and then heating the obtained polyamic acid for imidization. Amination reaction, obtain polyimide material, wherein, described polyimide material has following repeating structural unit:

[0034]

[0035] Wherein A is one or several organic compounds containing the following structures:

[0036]

[0037] m is an integer of 2-35, n is an integer of 2-35, p is an integer of 2-35, and n:m:p is 4-15:2-4:3-13, the polyimide material The coefficient of thermal expansion is 18-30ppm / ℃, and the coefficient of hygroscopic expansion is 2-12ppm.

[0038] The above-mentioned aromatic diamines include phenylenediamine-p-phenylenediamine, 4,4'-diaminodiphenyl ether, wherein the aromatic diamines include phenylenediamine-p-phenylenediamine, 4,4'-diamine The molar ratio of ...

Embodiment approach

[0058] According to a preferred embodiment of the present invention, the preparation method of the metal laminate provided by the present invention comprises the following steps:

[0059] (1) Add aromatic tetra-acid dianhydride and aromatic diamine into the solvent according to the molar ratio of 0.9-1.2:0.9-1.2, the amount of the solvent makes the concentration of the obtained polyamic acid 5-40% by weight, After stirring and reacting at 20-70°C for 3-15 hours, vacuum degassing at the same temperature for 1-12 hours to obtain a polyamic acid solution, wherein the aromatic diamines are biphenylenediamine, p-phenylenediamine, 4,4 '-diaminodiphenyl ether;

[0060] (2) At a temperature of 10-40°C and a relative humidity of 20-80%, the above polyamic acid solution is coated on a copper foil, dried at 20-200°C, and the solvent is removed to obtain a 5-50 micron polyamic acid film;

[0061] (3) For the above-mentioned copper foil covered with polyamic acid solution, the method of ...

Embodiment 1

[0076] With the pyromellitic dianhydride of 75g, the 4 of 13.76g, the 4'-diaminobiphenyl, the p-phenylenediamine of 12.65g, the 4 of 13.75g, the 4'-diaminodiphenyl ether (the molar ratio is 1.0: 0.2: 0.6: 0.2) according to adding 1030g of solvent to N, N-dimethylacetamide and mixing, the temperature is controlled at 20°C, and the time is 9 hours to obtain a polyamic acid with a solid content of 12% and a viscosity of 25000cp solution.

[0077] Filter the obtained polyamic acid solution, and vacuum degassing for 2 hours under the condition of a vacuum degree of 0.003 MPa. (Model QTG, Tianjin Jingke Material Testing Machine Factory) Coated on a copper foil with a size of 300×250×18 microns and a roughness of 0.6 microns, put it in an oven, and carried out segmentation under the condition of nitrogen atmosphere imidization by heating. Among them, the heating temperature of the first section is 70°C and the time is 10 minutes, the heating temperature of the second section is 150...

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Abstract

The invention provides a polyimide material, a preparation method thereof, a metal laminate plate containing the same and a preparation method of the metal laminate plate. The polyimide material contains a polymer having the following repeated structural unit: in a figure (I), A is one or more of organic compounds of the following structure; m is an integer between 2 and 35; n is an integer between 2 and 35; p is an integer between 2 and 35; and n:m:p is 4-15:2-4:3-13. The metal laminate plate prepared by the method provided by the invention has the characteristics that: a binding force between a polyimide resin layer and a metallic layer is good, the size stability of the polyimide resin layer is high; and the wet swelling coefficient is small.

Description

technical field [0001] The invention relates to a polyimide material and a preparation method, a metal laminate containing the polyimide material and a preparation method thereof. Background technique [0002] In recent years, the high-performance, high-functionality and miniaturization of electronic equipment have been rapidly developed. Along with this, the demand for high-density and high-performance electronic components used in electronic equipment and substrates for mounting them is increasing. Regarding flexible printed circuits FPC (hereinafter referred to as FPC) will develop towards thin wire processing and multi-layer formation. For the materials that make up FPC, there are more and more stringent requirements for thinning and dimensional stability. [0003] At present, among the base materials of flexible printed circuit boards produced, the most common one is to use adhesive to bond polyimide film and copper foil. In the prior art, bismaleimide modified nitrile...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10B32B15/08B32B27/28B32B15/20B05D7/24B05D3/00
Inventor 杨琼
Owner BYD CO LTD
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