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Metal laminated plate and preparation method thereof

A technology of laminates and metal layers, applied in the field of metal laminates for flexible printed circuits and its preparation, to achieve the effect of excellent dimensional stability

Active Publication Date: 2013-12-04
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the FCCL prepared by this method is processed into thin wires, the hygroscopic expansion effect is obvious, and the size changes greatly, which leads to the problem of poor line connection.
Another prior art discloses a laminate for circuit boards. In its technical solution, a polyimide with improved hydrophobicity and low hygroscopicity is introduced into the polyimide resin system by introducing a fluorine-based resin. However, the preparation cost of this method is high, the adhesive performance between the resin and the metal foil is poor, and the thermal dimensional stability is significantly reduced.

Method used

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  • Metal laminated plate and preparation method thereof

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Experimental program
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Effect test

Embodiment approach

[0036] According to a preferred embodiment of the present invention, the preparation method of the metal laminate provided by the present invention comprises the steps:

[0037] (1) adding aromatic tetra-acid dianhydride and aromatic diamine into the solvent according to the molar ratio of 0.9-1.2:0.9-1.2, the amount of the solvent makes the concentration of the obtained polyamic acid 5-40% by weight, After stirring and reacting at 20-70°C for 3-15 hours, vacuum degassing at the same temperature for 1-12 hours to obtain a polyamic acid solution, wherein the aromatic diamines are biphenylenediamine, p-phenylenediamine, 4,4 '-diaminodiphenyl ether;

[0038] (2) At a temperature of 10-40°C and a relative humidity of 20-80%, the above polyamic acid solution is coated on a copper foil, dried at 20-200°C, and the solvent is removed to obtain a 5-50 micron polyamic acid film;

[0039] (3) For the above-mentioned copper foil covered with polyamic acid solution, the method of gradien...

Embodiment 1

[0054] With the pyromellitic dianhydride of 74.9g, the 4 of 13.75g, the 4'-diaminobiphenyl, the p-phenylenediamine of 12.65g, the 4 of 13.75g, the 4'-diaminodiphenyl ether (the molar ratio is 1.0 : 0.2: 0.6: 0.2) According to the addition of 1030g of solvent N, N-dimethylacetamide and mixing, the temperature is controlled at 20 ° C, and the time is 9 hours to obtain a polyamide with a solid content of 12% and a viscosity of 25000cp acid solution.

[0055] Filter the obtained polyamic acid solution, and vacuum degassing for 2 hours under the condition of a vacuum degree of 0.003 MPa. (Model QTG, Tianjin Jingke Material Testing Machine Factory) Coated on a copper foil with a size of 300×250×18 microns and a roughness of 0.6 microns, put it in an oven, and carried out segmentation under the condition of nitrogen atmosphere imidization by heating. Wherein, the heating temperature of the first section is 70°C, and the time is 10 minutes; the heating temperature of the second sect...

Embodiment 2

[0057] This embodiment is used to illustrate the metal laminate provided by the present invention and its preparation method.

[0058] 83.71g of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 15.73g of 4,4'-diaminobiphenyl, 18.46g of p-phenylenediamine, 5.7g of 4,4'- Diaminodiphenyl ether (molar ratio 1.2:0.3:0.6:0.1) is added to 1030g of N,N-dimethylacetamide as a solvent and mixed, the temperature is controlled at 25°C, and the time is 9 hours to obtain the solid content 12% polyamic acid solution with a viscosity of 35000ccp.

[0059] Filter the obtained polyamic acid solution, and vacuum degassing for 2 hours under the condition of a vacuum degree of 0.003 MPa. (Model QTG, Tianjin Jingke Material Testing Machine Factory) coated on a copper foil with a thickness of 18 microns and a roughness of 0.6 microns, put it in an oven, and heat the acrylic acid in sections under a nitrogen atmosphere. Amination. Among them, the heating temperature of the first section is 70°C and ...

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Abstract

The invention provides a metal laminated plate and a preparation thereof. The metal laminated plate consists of a polyimide resin layer and a metal layer, wherein the thermal expansion coefficient ofthe polyimide resin layer is 18 to 30 ppm / DEG C, and the hygroscopic expansion coefficient of the polyimide resin layer is 2 to 16 ppm; and the peeling strength between the polyimide resin layer and the metal layer is 10 to 20 N / mm. The method for preparing the metal laminated plate comprises the following steps: firstly, dissolving aromatic tetracarboxylic dianhydride and aromatic diamine in an polar aprotic solvent for reaction to form solution of polyamic acid, wherein the aromatic diamine may be benzidine, para-phenylene diamine, or 4,4'-diamino diphenyl ether; and secondly, coating the polyamic acid solution on the metal layer, and performing imidization to obtain the metal laminated layer. The metal laminated layer prepared by the method has the characteristics of high binding forcebetween the polyimide resin layer and the metal layer, high dimensional stability of the polyimide resin layer and small hygroscopic expansion coefficient.

Description

technical field [0001] The invention relates to a metal laminate, in particular to a metal laminate for a flexible printed circuit and a preparation method thereof. Background technique [0002] Flexible copper clad laminate (FCCL) is the base material for the production of flexible printed circuit boards (FPC). In FCCL, it is common to use adhesive to bond polyimide film and copper foil. There are three layers of FCCL with glue , such as the use of bismaleimide modified nitrile rubber, or epoxy resin, acrylic resin as an adhesive in the prior art, together with polyimide layer and copper foil to form a flexible copper clad laminate with a three-layer structure , but due to the presence of adhesives, the heat resistance and dimensional stability of FCCL are reduced. [0003] With the rapid development of the electronics industry, higher requirements are put forward for the appearance and performance of electronic products. Short, small, light, thin and excellent comprehens...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B37/14C08J5/18C08G73/10H05K3/38H05K1/03
Inventor 杨琼
Owner BYD CO LTD
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