Polytetrafluoroethylene high-frequency copper-clad plate with high thermal conductivity

A technology of polytetrafluoroethylene substrate and polytetrafluoroethylene, which is applied in household appliances, other household appliances, lamination, etc., can solve the problems of large thermal expansion coefficient of copper clad laminates, poor thermal stability, and influence on the use of copper clad laminates, and achieve excellent Effects of dielectric properties, increased peel strength, and reduced thermal expansion coefficient

Active Publication Date: 2020-11-27
无锡睿龙新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The copper clad laminate has high thermal conductivity and excellent electrical properties, but the copper clad laminate has a large thermal expansion coefficient, poor thermal stability, and high water absorption, which affects the use of the copper clad laminate

Method used

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  • Polytetrafluoroethylene high-frequency copper-clad plate with high thermal conductivity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A polytetrafluoroethylene high-frequency copper clad laminate with high thermal conductivity comprises two copper layers and a high thermal conductivity polytetrafluoroethylene substrate located between the two copper layers. The preparation method is as follows: after drying the high thermal conductivity polytetrafluoroethylene substrate, cut the edge according to the requirements, cover the two sides of the substrate (one or more) with copper foil, and then send the combined semi-finished product to the hot plate by the automatic conveyor. The press is hot-pressed. In a vacuum environment, the hot-pressing pressure is 25-40MPa, the hot-pressing temperature is 350-400°C, and the heat preservation is 4-6h, so that the substrate and copper foil are integrated into one, and finally become the surface copper foil, the middle The finished copper clad laminate of the insulating layer; after cooling, trim off the excess side strips of the dismantled product, and cut it into th...

Embodiment 2

[0043] A polytetrafluoroethylene high-frequency copper clad laminate with high thermal conductivity comprises two copper layers and a high thermal conductivity polytetrafluoroethylene substrate located between the two copper layers. Its preparation method is the same as Example 1, and the specific steps refer to Example 1.

[0044] The above-mentioned high thermal conductivity polytetrafluoroethylene substrate is composed of the following raw materials in parts by weight: 80 parts of PTFE / BN composite material, 0.8 parts of phosphoric acid monoalkoxy titanate TMC-2, 5 parts of titanium powder, and 6.2 parts of silicon oxide parts, 5 parts of yttrium oxide, 3 parts of aluminum oxide and appropriate amount of ethanol. Its preparation method comprises the following steps:

[0045] S1. Weigh silicon oxide, yttrium oxide and aluminum oxide according to the mass fraction, and ball mill them until the particle size is 1-3 μm, and then sinter after mixing evenly. The sintering temper...

Embodiment 3

[0053] A polytetrafluoroethylene high-frequency copper clad laminate with high thermal conductivity comprises two copper layers and a high thermal conductivity polytetrafluoroethylene substrate located between the two copper layers. Its preparation method is the same as Example 1, and the specific steps refer to Example 1.

[0054] The above-mentioned high thermal conductivity polytetrafluoroethylene substrate is composed of the following raw materials in parts by weight: 75 parts of PTFE / BN composite material, 1 part of phosphoric acid type monoalkoxy titanate TMC-2, 6 parts of titanium powder, 5 parts of silicon oxide 8 parts of yttrium oxide, 5 parts of aluminum oxide and appropriate amount of ethanol. Its preparation method comprises the following steps:

[0055] S1. Weigh silicon oxide, yttrium oxide and aluminum oxide according to the mass fraction, and ball mill them until the particle size is 1-3 μm, and then sinter after mixing evenly. The sintering temperature is se...

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Abstract

The invention discloses a polytetrafluoroethylene high-frequency copper-clad plate with high thermal conductivity, and relates to the technical field of high-frequency copper-clad plates. The invention discloses the polytetrafluoroethylene high-frequency copper-clad plate with high thermal conductivity, which comprises two copper layers, and characterized by comprising a high-thermal-conductivitypolytetrafluoroethylene substrate positioned between the two copper layers; the high-thermal-conductivity polytetrafluoroethylene substrate is prepared from the following raw materials in parts by weight: 70-80 parts of a PTFE/BN composite material, 0.8-1.5 parts of a titanate coupling agent, 5-10 parts of titanium powder, 5-8 parts of silicon oxide, 5-8 parts of yttrium oxide, 3-5 parts of aluminum oxide and a proper amount of ethanol. The invention further discloses the preparation method of the PTFE/BN composite material and a preparation method of the high-thermal-conductivity polytetrafluoroethylene substrate. The PTFE high-frequency copper-clad plate provided by the invention has the advantages of excellent heat-conducting property, higher dielectric constant, lower dielectric loss,high peel strength, high mechanical strength, low water absorption and low thermal expansion coefficient.

Description

technical field [0001] The invention belongs to the technical field of high-frequency copper-clad laminates, and in particular relates to a polytetrafluoroethylene high-frequency copper-clad laminate with high thermal conductivity. Background technique [0002] With the rapid development of the information industry and electronics industry represented by smart electronic products, digital circuits have gradually entered the stage of high-speed information processing and high-frequency signal transmission. Development in the direction of high efficiency and low cost. High-frequency and high-speed substrate materials mainly solve the high-frequency characteristic defects of ordinary copper clad laminates in the fields of microwave and millimeter waves in communication, such as unstable transmission performance and large loss. Therefore, higher and more urgent requirements are put forward for the low dielectric properties of copper clad laminates. In order to obtain fast, clea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/085B32B27/32B32B27/18B32B37/06B32B37/10C08L27/18C08K13/06C08K9/06C08K9/02C08K3/38C08K3/08C08K3/36C08K3/22B29C43/00
CPCB29C43/003B29L2007/002B32B15/085B32B15/20B32B27/18B32B27/322B32B37/06B32B37/10B32B2307/302B32B2307/308B32B2307/546B32B2307/554B32B2307/726C08K3/08C08K3/22C08K3/36C08K3/38C08K9/02C08K9/06C08K13/06C08K2003/0881C08K2003/221C08K2003/2227C08K2003/385C08L27/18
Inventor 向中荣
Owner 无锡睿龙新材料科技有限公司
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