Preparation method of thin film used for flexible high-frequency copper clad laminate

A copper-clad laminate and high-frequency technology, which is applied in the field of preparation of thermoplastic polyimide/modified silica composite film, can solve the problem of failure to effectively reduce the thermal expansion coefficient of polyimide film, polyimide is easy to absorb water, etc. problems, to achieve the effect of reducing the probability of crack sources, avoiding environmental pollution, and avoiding microsphere agglomeration

Active Publication Date: 2019-09-10
SYNERGY INNOVATION INST OF GDUT HEYUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above methods have played an important role in the application of polyimide to the industrialization of flexible / flexible high-frequency copper-clad laminates. Thermal Expansion Coefficient of Polyimide Film

Method used

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  • Preparation method of thin film used for flexible high-frequency copper clad laminate
  • Preparation method of thin film used for flexible high-frequency copper clad laminate
  • Preparation method of thin film used for flexible high-frequency copper clad laminate

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preparation example Construction

[0036] A method for preparing a thin film that can be used for flexible high-frequency copper-clad laminates, characterized in that it comprises the following steps:

[0037] S1. preparing nano-silica microsphere emulsion;

[0038] S2. Preparation of thermoplastic polyimide / modified silica composite film:

[0039] S21. Mix and stir the diamine reagent, dodecyltrimethylammonium chloride and deionized water to obtain a uniform mixed solution;

[0040] S22. adding the silicon dioxide microsphere emulsion into the mixed solution, stirring evenly to obtain a uniform mixed emulsion;

[0041] S23. Add the dianhydride reagent and the silane coupling agent into the mixed emulsion, stir for 4-8 hours in a water bath at 4-15°C under the protection of an inert gas, and then stop stirring to obtain a polyamic acid copolymer and modified Composite emulsion of silicon dioxide; preferably, the inert gas is argon, and the gas intake rate of the argon is 0.1-1L / min; the solid content of the p...

Embodiment 1

[0061] S1. Preparation of nano-silica microspheres:

[0062] S11. Take 9g of tetraethyl orthosilicate and 100mL of ethanol (concentration is greater than 99.7wt%, the same below) in a beaker, and stir at a constant speed of 200RPM for 5min until the two are evenly mixed to obtain a mixed ethyl orthosilicate ethanol solution;

[0063] S12. Take 5mL of deionized water, 15mL of ammonia water (concentration: 25wt.%), and 80mL of ethanol in a beaker, and stir at a constant speed of 200RPM for 5min until the two are evenly mixed to obtain a mixed ammonia-ethanol solution;

[0064] S13. Under the condition of stirring at a constant speed of 500RPM, quickly add the prepared ammonia solution into the prepared tetraethyl orthosilicate solution, react for 10 hours under the condition of stirring at a constant speed of 500RPM, stop stirring, and place the mixed turbid solution in a centrifuge In the machine, centrifuge at 6000RPM to obtain silica microspheres with a particle size of 200-3...

Embodiment 2

[0082] Others are the same as in Example 1, except that the volume of the silica emulsion added in the second step (2) is 2 mL, and the silane coupling agent added in the second step (3) is 0.03 g.

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Abstract

The invention relates to a preparation method of a thermoplastic polyimide/modified silicon dioxide composite film which can be used for a flexible high-frequency copper clad laminate. The specific steps comprise preparing a nano-silica microsphere emulsion, preparing thermoplastic polyimide, using a silane coupling agent as a surfactant to combine polyimide and silicon dioxide, wherein the surface of nano-SiO2 is coated with the thermoplastic polyimide molecular layer, and the water absorbency of the composite is improved by adding SiO2, SiO2 is uniformly dispersed in the composite film, SiO2is used as a particle to restrict the expansion of the composite film in the thermal expansion process of the composite film, and the thermal expansion performance of the polyimide is effectively improved. After the preparation of silicon dioxide, silicon dioxide directly participates in the composite reaction with a polyimide precursor without drying, thereby avoiding the agglomeration of microspheres in the drying process during industrial production of nano-silicon dioxide, and enhancing the bending resistance of the prepared copper clad laminate.

Description

technical field [0001] The invention relates, in particular, to a method for preparing a thermoplastic polyimide / modified silicon dioxide composite film that can be used for flexible high-frequency copper-clad laminates. Background technique [0002] Copper clad laminate (CCL), as the substrate of printed circuit board (PCB), is an important part for connecting and supporting electronic components. With the rapid development of the mobile communication industry, people have put forward higher requirements on the mechanical properties, signal transmission performance, stability performance and heat dissipation performance of electronic products. Since the advent of build-up multilayer boards (high-density interconnected multilayer boards) in Japan in the early 1990s, the copper clad laminate industry is developing in the direction of high frequency and high performance. In addition, the harmonious development of man and nature is a problem that human beings must face in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K5/5425C08K7/18C08J5/18C08L79/08B32B37/06B32B37/10
CPCC08J5/18C08G73/1071C08G73/105C08G73/1042C08K5/5425C08K7/18B32B37/06B32B37/10C08J2379/08C08K2201/011B32B2307/726B32B2457/08
Inventor 谭台哲张永光黄国宏唐浩
Owner SYNERGY INNOVATION INST OF GDUT HEYUAN
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