Method for preparing nano silicon by pulsed laser deposition
A pulsed laser deposition, nano-silicon technology, applied in the direction of ion implantation plating, coating, metal material coating process, etc., to achieve the effect of good photoluminescence characteristics and increase application prospects
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Embodiment 1
[0035] A method for preparing nano-silicon by pulsed laser deposition, which is realized by using pulsed laser deposition equipment in the following steps:
[0036] (1) figure 1 It is a schematic diagram of the nano-silicon structure prepared by pulsed laser deposition, figure 1 (a) is a schematic diagram of planar high-purity silicon target deposition, figure 1 (b) is a schematic diagram of the deposition of arc-shaped high-purity silicon targets. Using ordinary planar silicon targets, the silicon nanoparticles produced by laser ablation are seriously agglomerated, so arc-shaped silicon targets are used.
[0037] select figure 1 (b) The curved silicon target shown in (b) has an arc of about 0.3 rad and a target diameter of 60 mm. The silicon target material is high-purity polysilicon. To clean the high-purity polysilicon target, the steps are to use toluene, ethanol, and acetone to ultrasonically clean the target. Clean for 10 minutes, and repeat the above cleaning steps ...
Embodiment 2
[0047] A method for preparing nano-silicon by pulsed laser deposition, which is realized by using pulsed laser deposition equipment in the following steps:
[0048] (1) selection figure 1 (b) The curved silicon target shown in (b), the arc of the silicon target is about 0.35rad, and the target diameter is 60mm. The silicon target material is high-purity polysilicon. To clean the high-purity polysilicon target, the steps are to use toluene, ethanol, and acetone in order to ultrasonically clean the silicon target. Clean for 10 minutes, and repeat the above cleaning steps 5 times; use the standard RCA silicon wafer cleaning process to clean the silicon single crystal substrate. 2. SC-1 is H 2 o 2 and NH 4 Alkaline solution of OH, SC-2 is H 2 o 2 Acidic solution with HCl, DHF is a mixture of HF and pure water, also called diluted hydrofluoric acid DHF (diluted HF);
[0049] (2) The silicon target is loaded into the rotating target position for pulsed laser deposition;
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Embodiment 3
[0059] A method for preparing nano-silicon by pulsed laser deposition, which is realized by using pulsed laser deposition equipment in the following steps:
[0060] (1) selection figure 1 (b) The curved silicon target shown in (b), the arc of the silicon target is about 0.35rad, and the target diameter is 60mm. The silicon target material is high-purity polysilicon. To clean the high-purity polysilicon target, the steps are to use toluene, ethanol, and acetone in order to ultrasonically clean the silicon target. Clean for 10 minutes, and repeat the above cleaning steps 5 times; use the standard RCA silicon wafer cleaning process to clean the silicon single crystal substrate. 2. SC-1 is H 2 o 2 and NH 4 Alkaline solution of OH, SC-2 is H 2 o 2 Acidic solution with HCl, DHF is a mixture of HF and pure water, also called diluted hydrofluoric acid DHF (diluted HF);
[0061] (2) The silicon target is loaded into the rotating target position for pulsed laser deposition;
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