Method for manufacturing high-heat conduction ceramic circuit board

A technology of high thermal conductivity ceramics and production methods, applied in printed circuits, removal of conductive materials by chemical/electrolytic methods, and printed circuit manufacturing, etc. , to achieve the effect of good heat conduction and heat dissipation, simple processing technology, and prevention of breakage and damage

Inactive Publication Date: 2010-04-28
广东达进电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, traditional lighting generally uses incandescent lamps or fluorescent lamps, in which incandescent lamps consume a lot of energy and have weak luminous efficacy; fluorescent lamps contain mercury, which is not environmentally friendly, and their energy consumption is relatively large, and their luminous efficacy is relatively weak
In order to solve this problem, people invented light-emitting LEDs, but in practical applications, only about 20% of the existing light-emitting LEDs produce light for every 100% of energy, while 80% of the energy is turned into heat energy loss, so heat is the largest energy consumption , but at the same time, if the excess heat energy is not removed, the service life of the LED will be reduced
The heat dissipation of LED is mainly through its packaging substrate, but as the packaging substrate becomes smaller and smaller, the heat generated by the LED cannot be effectively dissipated. At present, FR4 material or resin with ceramic

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1

[0027] The production method of the high thermal conductivity ceramic circuit board of the present invention includes the following steps:

[0028] a. Pretreatment of the substrate

[0029] Mainly include: incoming inspection → degreasing → pickling → drying and other processes;

[0030] The specific method is to clean the surface of the ceramic copper clad substrate that has passed the inspection. The specific method is to use sodium persulfate or ammonium persulfate to microetch the copper clad layer of the ceramic copper clad substrate to remove the oil and dirt on the copper clad layer. The oxide on the surface is more effective than the physical method used to clean the circuit board substrate, which is more effective in preventing damage to the ceramic copper-clad substrate, because the physical method is generally to first compress the substrate, and then use a roller brush on its surface at high speed Rotation, through the friction of the roller brush on th...

Example Embodiment

[0046] Example 2

[0047] The production method of the high thermal conductivity ceramic circuit board of the present invention includes the following steps:

[0048] a. Pretreatment of the substrate

[0049] Mainly include: incoming inspection → degreasing → pickling → drying and other processes;

[0050] The specific method is to clean the surface of the ceramic copper clad substrate that has passed the inspection. The specific method is to use sodium persulfate or ammonium persulfate to microetch the copper clad layer of the ceramic copper clad substrate to remove the oil and dirt on the copper clad layer. The oxide on the surface is more effective than the physical method used to clean the circuit board substrate, which is more effective in preventing damage to the ceramic copper-clad substrate, because the physical method is generally to first compress the substrate, and then use a roller brush on its surface at high speed Rotation, through the friction of the roller brush on th...

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PUM

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Abstract

The invention discloses a method for manufacturing a high-heat conduction ceramic circuit board, which comprises the steps of a, substrate pretreatment; b, pattern transfer; c, solder mask printing; d, character silk printing; e, electroless nickel immersion gold; and f, cutting and moulding. The invention aims to overcome the disadvantage in the prior art, and provides a method for manufacturing a high-heat conduction ceramic circuit board having simple process and good heat conducting and heat dissipating effects.

Description

Technical field [0001] The invention relates to a production method of a high thermal conductivity ceramic circuit board. Background technique [0002] With the continuous development of science and technology and the continuous improvement of people's material and spiritual civilization, people are increasingly energy-saving and environmentally friendly in the development of electronic products. For example, traditional lighting generally uses incandescent lamps or fluorescent lamps, among which incandescent lamps have high energy consumption and weak light efficiency; fluorescent lamps contain mercury, which is not environmentally friendly, and their energy consumption is relatively large, and the light efficiency is relatively weak. In order to solve this problem, people invented the light-emitting LED, but in actual applications, only about 20% of the existing light-emitting LED generates light for every 100% of the energy, and 80% of the energy becomes heat loss, so heat is ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06H05K3/22
Inventor 王斌陈华巍姚静宇盛从学
Owner 广东达进电子科技有限公司
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