Method for manufacturing high-heat conduction ceramic circuit board

[0026] Example 1

[0027] The production method of the high thermal conductivity ceramic circuit board of the present invention includes the following steps:

[0028] a. Pretreatment of the substrate

[0029] Mainly include: incoming inspection → degreasing → pickling → drying and other processes;

[0030] The specific method is to clean the surface of the ceramic copper clad substrate that has passed the inspection. The specific method is to use sodium persulfate or ammonium persulfate to microetch the copper clad layer of the ceramic copper clad substrate to remove the oil and dirt on the copper clad layer. The oxide on the surface is more effective than the physical method used to clean the circuit board substrate, which is more effective in preventing damage to the ceramic copper-clad substrate, because the physical method is generally to first compress the substrate, and then use a roller brush on its surface at high speed Rotation, through the friction of the roller brush on the surface of the substrate, clean the oxide on the oily surface, but this method cannot be applied to the ceramic copper-clad substrate, because the ceramic layer of the ceramic copper-clad substrate is relatively brittle and easy fracture. After the microetched ceramic copper-clad substrate is pickled, it is dried and enters the next process;

[0031] b, graphics transfer

[0032] Mainly include: lamination → exposure → development → etching → film removal → drying → inspection and other processes;

[0033] The specific method is: print a layer of photosensitive ink or paste a photosensitive film on the copper clad layer of the above-mentioned ceramic copper clad substrate, and after the photosensitive ink or photosensitive film is dried, use the light drawing circuit pattern film that has been made to place it on the ceramic copper clad substrate On the upper and lower sides, the circuit pattern is exposed, the exposed ceramic copper-clad substrate is developed, and the development shows the exposed and light-solid circuit pattern, and the above-mentioned exposed ceramic copper-clad substrate is etched by using an etching solution or an etching machine. Three etchings are required, the first etching is performed at 1.5m/min, the second etching is performed at 2.0m/min, and the third etching is performed at 5.5m/min. After the film is removed and dried, the defective products are detected and removed by automatic optical equipment. ; Then wash and dry into the next step;

[0034] c. Printing solder mask ink

[0035] Mainly include: pretreatment → printing ink → pre-drying → exposure → development → thermal curing and other processes;

[0036] The specific method is: cleaning and drying the above-mentioned ceramic copper-clad substrate, printing solder mask ink where there is no need for soldering electronic components; pre-drying in a drying box, exposure and development, and then thermal curing; printing; The solder resist ink can effectively prevent the solder from sticking to the non-solder area when soldering electronic components. At the same time, printing the solder resist ink can also protect some conductive layers on the circuit board from moisture corrosion and increase the aesthetics of the product; then clean and dry to enter Next step

[0037] d. Silkscreen text

[0038] Mainly include: silk screen text → heat curing and other processes;

[0039] The specific method is: according to the design requirements, silk-screen text on the corresponding place of the above-mentioned substrate and then heat curing; to facilitate the production and processing and then solder the electronic components in the corresponding place; to bring convenience to the assembly and production of the circuit board; then the cleaning and drying enter the next step Process

[0040] e. Electroless nickel and gold

[0041] Mainly include: degreasing → pickling → micro-etching → prepreg → immersion nickel → immersion gold → drying and other processes;

[0042] The specific method is: degreasing and cleaning the above-mentioned substrate, then pickling, microetching in sodium persulfate or ammonium persulfate solution, pre-soaking in nickel plating solution after cleaning, and then using electroless nickel and gold methods Deposit a layer of chemical nickel with a thickness of 100-200μ" on the copper-clad layer of electronic components to be soldered, and then electroplate a layer of gold with a thickness of 3μ"; then clean and dry into the next step;

[0043] f, cutting and forming

[0044] Mainly include: laser cutting → cleaning → inspection → packaging and other processes;

[0045] The specific method is: use a laser cutting equipment of 8W or more to cut the electroless nickel and gold substrates into predetermined specifications, clean and dry with clean water, and then electronically detect them. The qualified product is the product of the present invention, and then it can be packaged.

[0046] Example 2

[0047] The production method of the high thermal conductivity ceramic circuit board of the present invention includes the following steps:

[0048] a. Pretreatment of the substrate

[0049] Mainly include: incoming inspection → degreasing → pickling → drying and other processes;

[0050] The specific method is to clean the surface of the ceramic copper clad substrate that has passed the inspection. The specific method is to use sodium persulfate or ammonium persulfate to microetch the copper clad layer of the ceramic copper clad substrate to remove the oil and dirt on the copper clad layer. The oxide on the surface is more effective than the physical method used to clean the circuit board substrate, which is more effective in preventing damage to the ceramic copper-clad substrate, because the physical method is generally to first compress the substrate, and then use a roller brush on its surface at high speed Rotation, through the friction of the roller brush on the surface of the substrate, clean the oxide on the oily surface, but this method cannot be applied to the ceramic copper-clad substrate, because the ceramic layer of the ceramic copper-clad substrate is relatively brittle and easy fracture. After the microetched ceramic copper-clad substrate is pickled, it is dried and enters the next process;

[0051] b, graphics transfer

[0052] Mainly include: lamination → exposure → development → etching → film removal → drying → inspection and other processes;

[0053] The specific method is: print a layer of photosensitive ink or paste a photosensitive film on the copper clad layer of the above-mentioned ceramic copper clad substrate, and after the photosensitive ink or photosensitive film is dried, use the light drawing circuit pattern film that has been made to place it on the ceramic copper clad substrate On the upper and lower sides, the circuit pattern is exposed, the exposed ceramic copper-clad substrate is developed, and the development shows the exposed and light-solid circuit pattern, and the above-mentioned exposed ceramic copper-clad substrate is etched by using an etching solution or an etching machine. Three etchings are required, the first etching is performed at 1.5m/min, the second etching is performed at 2.0m/min, and the third etching is performed at 5.5m/min. After the film is removed and dried, the defective products are detected and removed by automatic optical equipment. ; Then wash and dry into the next step;

[0054] c. Printing solder mask ink

[0055] Mainly include: pretreatment → printing ink → pre-drying → exposure → development → thermal curing and other processes;

[0056] The specific method is: cleaning and drying the above-mentioned ceramic copper-clad substrate, printing solder mask ink where there is no need for soldering electronic components; pre-drying in a drying box, exposure and development, and then thermal curing; printing; The solder resist ink can effectively prevent the solder from sticking to the non-solder area when soldering electronic components. At the same time, printing the solder resist ink can also protect some conductive layers on the circuit board from moisture corrosion and increase the aesthetics of the product; then clean and dry to enter Next step

[0057] d. Silkscreen text

[0058] Mainly include: silk screen text → heat curing and other processes;

[0059] The specific method is: according to the design requirements, silk-screen text on the corresponding place of the above-mentioned substrate and then heat curing; to facilitate the production and processing and then solder the electronic components in the corresponding place; to bring convenience to the assembly and production of the circuit board; then the cleaning and drying enter the next step Process

[0060] e. Electroless nickel and gold

[0061] Mainly include: degreasing → pickling → micro-etching → prepreg → immersion nickel → immersion gold → drying and other processes;

[0062] The specific method is: degreasing and cleaning the above-mentioned substrate, then pickling, microetching in sodium persulfate or ammonium persulfate solution, pre-soaking in nickel plating solution after cleaning, and then using electroless nickel and gold methods Deposit a layer of chemical nickel with a thickness of 100-200μ" on the copper-clad layer of electronic components to be soldered, and then electroplate a layer of gold with a thickness of 3μ"; then clean and dry into the next step;

[0063] f. Silk screen blue glue

[0064] The specific method is to print a circle of blue glue around the predetermined fluorescent glue area, and then dry it. During the processing, apply fluorescent glue in the area enclosed by the blue glue as needed, because the surface of the blue glue is rough after curing. , Effectively prevent the fluorescent glue from flowing outside the predetermined area;

[0065] g, cutting and forming

[0066] Mainly include: laser cutting → cleaning → inspection → packaging and other processes;

[0067] The specific method is: use a laser cutting equipment of 8W or more to cut the electroless nickel and gold substrates into predetermined specifications, clean and dry with clean water, and then electronically detect them. The qualified product is the product of the present invention, and then it can be packaged.