Method for manufacturing high-heat conduction ceramic circuit board

Abstract

The invention discloses a method for manufacturing a high-heat conduction ceramic circuit board, which comprises the steps of a, substrate pretreatment; b, pattern transfer; c, solder mask printing; d, character silk printing; e, electroless nickel immersion gold; and f, cutting and moulding. The invention aims to overcome the disadvantage in the prior art, and provides a method for manufacturing a high-heat conduction ceramic circuit board having simple process and good heat conducting and heat dissipating effects.

Description

Technical field [0001] The invention relates to a production method of a high thermal conductivity ceramic circuit board. Background technique [0002] With the continuous development of science and technology and the continuous improvement of people's material and spiritual civilization, people are increasingly energy-saving and environmentally friendly in the development of electronic products. For example, traditional lighting generally uses incandescent lamps or fluorescent lamps, among which incandescent lamps have high energy consumption and weak light efficiency; fluorescent lamps contain mercury, which is not environmentally friendly, and their energy consumption is relatively large, and the light efficiency is relatively weak. In order to solve this problem, people invented the light-emitting LED, but in actual applications, only about 20% of the existing light-emitting LED generates light for every 100% of the energy, and 80% of the energy becomes heat loss, so heat is ...

AI Technical Summary

Problems solved by technology

For example, traditional lighting generally uses incandescent lamps or fluorescent lamps, in which incandescent lamps consume a lot of energy and have weak luminous efficacy; fluorescent lamps contain mercury, which is not environmentally friendly, and their energy consumption is relatively large, and their luminous efficacy is relatively weak

In order to solve this problem, people invented light-emitting LEDs, but in practical applications, only about 20% of the existing light-emitting LEDs produce light for every 100% of energy, while 80% of the energy is turned into heat energy loss, so heat is the largest energy consumption , but at the same time, if the excess heat energy is not removed, the service life of the LED will be reduced

The heat dissipation of LED is mainly through its packaging substrate, but as the packaging substrate becomes smaller and smaller, the heat generated by the LED cannot be effectively dissipated. At present, FR4 material or resin with ceramic powder is generally used as the substrate, but this substrate The heat conduction effect of the LED is not ideal; there are also metal substrates such as aluminum substrates as substrates. This substrate is covered with a layer of resinous material as a dielectric layer on these metal substrates. The heat generated by the LED must first pass through the dielectric layer. The dielectric layer is then transmitted to the metal substrate. Due to the poor thermal conductivity of the dielectric layer, the overall heat dissipation function is affected. In addition, metal substrates such as aluminum substrates are prone to deformation when heated, and their dimensional stability is relatively poor, so they are not suitable for heat dissipation. The packaging substrate used; use resin-free ceramic materials as the substrate of the circuit board, which has good heat conduction and heat dissipation effects, but its application is limited due to its complicated processing technology