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Alkyl sulfonic acid chemical tinning solution and chemical tinning solution based tinning process

A technology of alkyl sulfonic acid chemistry and tin plating solution, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of high cost, high price, complicated processing process, etc., and achieve good solderability Sexuality, bright coating effect

Inactive Publication Date: 2010-05-12
广州电器科学研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In practical applications, OSP surface coating is suitable for general consumer electronic products, with satisfactory performance and low price; nickel / gold coating is mostly used for durable industrial electronic products, but the processing process is relatively complicated and the cost is high; precious metals such as platinum and rhodium are coated The layer is only used in high-performance electronic products with special requirements, and the performance is good and the price is very high

Method used

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  • Alkyl sulfonic acid chemical tinning solution and chemical tinning solution based tinning process
  • Alkyl sulfonic acid chemical tinning solution and chemical tinning solution based tinning process
  • Alkyl sulfonic acid chemical tinning solution and chemical tinning solution based tinning process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The alkylsulfonic acid electroless tin plating process includes the following steps:

[0043] 1) Pretreatment: Degreasing, pickling, and micro-etching the copper or copper alloy workpiece to be plated, and then replacing a thin and uniform tin layer on the surface of the copper or copper alloy workpiece by conventional methods to complete the preplating treatment ;

[0044] 2) Put the pretreated copper or copper alloy workpiece into an alkylsulfonic acid chemical tin plating solution for tin plating; wherein, the temperature T of the chemical tin plating bath is 50°C, the pH value of the plating solution is 1.5, and the time t is 20 minutes ;

[0045] 3) Neutralize and prevent discoloration by conventional methods after tin plating.

[0046] In step 2), the alkylsulfonic acid electroless tin plating solution is prepared according to the ingredients listed in Table 1.

[0047] The obtained tin layer was dried and tested for performance, and the test results are shown in...

Embodiment 2

[0053] The difference from Example 1 is: step 2) put the pretreated copper or copper alloy workpiece into an alkylsulfonic acid chemical tin plating solution for tin plating; wherein, the temperature T of the chemical tin plating bath is 55° C., and the plating solution The pH value is 2.0, and the time t is 30 minutes.

[0054] In step 2), the alkylsulfonic acid electroless tin plating solution is formulated according to the ingredients listed in Table 3. The test results are shown in Table 4.

[0055] Table three

[0056]

[0057]

[0058] Table four

[0059] Exterior

Embodiment 3

[0061] The difference from Example 1 is: step 2) putting the pretreated copper or copper alloy workpiece into an alkylsulfonic acid chemical tin plating solution for tin plating; wherein, the temperature T of the chemical tin plating bath is 65° C., and the plating solution The pH value is 1.5, and the time t is 15 minutes.

[0062] In step 2), the alkylsulfonic acid electroless tin plating solution is formulated according to the ingredients listed in Table 5. The tested results are shown in Table 6.

[0063] Table five

[0064]

[0065] Table six

[0066] Exterior

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PUM

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Abstract

The invention discloses alkyl sulfonic acid chemical tinning solution, which comprises the following components in terms of contents: 1 to 40 g / L of organic sulfonic acid tin salt, 5 to 250 g / L of organic acid, 5 to 300 g / L of complexing agent, 20 to 150 g / L of reducing agent, 0.5 to 50 g / L of surfactant, 0.1 to 25 g / L of antioxidant, 1 to 500 mg / L of noble metal salt and 0.5 to 3 g / L of brightening agent. The invention also discloses an alkyl sulfonic acid chemical tinning solution based tinning process, which comprises the following steps: 1) pre-treating a copper or copper alloy workpiece to be tinned; 2) putting the pre-treated copper or copper alloy workpiece into the alkyl sulfonic acid chemical tinning solution to be tinned; and 3) after tinning, performing neutralization and color change preventing treatment. The process adopts a two-step method of presoaking and chemical tinning to deposit a tin layer with the thickness of 2.0 mu m on the copper or copper alloy matrix; and the tin layer is applied to chemical tinning processes for PCBs and integrated circuits and the like, has the advantages of good weldability, strong whisker growth resistance, low cost, stable process and the like.

Description

technical field [0001] The invention relates to an electroless tin plating solution and a tin plating process based on the chemical tin plating solution, in particular to an alkylsulfonic acid chemical tin plating solution and a tin plating process based on the chemical tin plating solution. Background technique [0002] In order to ensure the solderability of printed circuit boards and electronic components in future assembly and use, solderability plating or treatment should be performed on the surface circuits to ensure their good solderability. Hot air leveling has been done on the surface of PCB Dominance in the treatment process. In the 1980s, more than three-quarters of PCBs used the hot air leveling process. Hot air leveling, also known as hot air solder leveling, is a process of coating molten tin-lead solder on the surface of the PCB and leveling it with heated compressed air. It forms a layer of coating that resists copper oxidation and provides good solderabilit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/52
Inventor 韩文生顾宇昕
Owner 广州电器科学研究院
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