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Heat dissipation structure and manufacturing method thereof

A technology of a heat dissipation structure and a manufacturing method, which is applied to heat exchange equipment, indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of increased manufacturing cost, inability to fluid heat dissipation structure, and increased cost, so as to improve the heat dissipation effect and improve the Effect of heat conduction effect

Active Publication Date: 2012-01-25
陈盈同 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In the above-mentioned known technology, although the heat conduction structure 10 has good heat conduction characteristics, its manufacturing process needs to be carried out in an environment of high temperature and high pressure, which will cause a substantial increase in manufacturing cost, and it is not easy to control the temperature and pressure. When the temperature is too high or the pressure is too high, there will be concerns of damaging the diamond particles 12, so the control of temperature and pressure not only has the problem of cost increase, but also has the problem of difficult process
Furthermore, the heat conduction structure 10 is pressurized to form a block-shaped solid structure, and there is no gap inside. Therefore, in the environment of fluid circulation, the heat conduction structure 10 will not be able to be a fluid heat dissipation structure, and thus cannot achieve the desired effect. Cooling effect

Method used

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  • Heat dissipation structure and manufacturing method thereof
  • Heat dissipation structure and manufacturing method thereof
  • Heat dissipation structure and manufacturing method thereof

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Embodiment 1

[0058] Embodiment 1, wherein the copper powder that uses is the copper powder of 70-150 mesh (Mesh) and the diamond particle of 80-100 mesh, and mixing volume ratio is 6: 1, as Figure 9A and Figure 9B Shown is the structure of the carbonaceous composite material layer of the heat dissipation structure of the present invention at an optical microscope magnification of 300X. The diamond particles in the picture are produced by China Taiwan Jiangxin Company (FACT) product number CK-3 (such as Figure 9A shown) and YK-J (as shown Figure 9B As shown), the diamond particles of CK-3 are diamonds on the primary surface, and the diamond crystal plane shape is relatively complete. The diamonds of YK-J are crushed and formed, and the surface is mostly irregular. Since diamond and copper powder cannot be melted together, when the carbonaceous composite material layer of the heat dissipation structure of the present invention is made into a porous structure by mutual sintering of diam...

Embodiment 2

[0059] Example 2, because the porous capillary structure inside the flat heat pipe should have enough capillary force to absorb water to the evaporation end, and also have appropriate pores to allow the cooling water to flow back, so different particle sizes will be used when designing the capillary structure Copper powder and copper powder of different shapes to achieve the balance between the two. The capillary structure at the condensing end needs to have larger pores so that the steam can quickly flow back to the evaporating end after turning into water, so the pores of the capillary structure should not be too tight; while the capillary structure at the evaporating end needs to have a larger capillary force to move water from the condensing end Pull back to the evaporation end, so a capillary structure with denser pores is required. Therefore, the heat dissipation structure of this case, that is, the flat heat pipe can be designed with a capillary structure of different po...

Embodiment 3

[0060] Embodiment 3, because the specific gravity of diamond is 3.52, and the specific gravity of copper is 8.9, both gap is very big, moreover, because the surface area of ​​two kinds of materials is also different, therefore require uniform mixing in the middle of mixing, and the size of particle also can't The difference is too large, because in the process of capillary structure, when diamond particles and copper powder are evenly mixed, powder needs to be filled in graphite molds. In order to make these powders have dense pores after sintering, it can also control the uniformity of product quality. The powder-filled mold needs to be vibrated or shaken to densify the powder. For example, when the particle size of the diamond is too large, the diamond will be separated from the copper powder after the mold vibrates after filling the powder, and the copper powder cannot hold the diamond, causing sintering failure; when the diameter of the diamond particle is much smaller than...

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Abstract

The invention discloses a heat dissipation structure and a manufacturing method thereof. The heat dissipation structure is applied to a heat energy generation part in an electronic device. The heat dissipation structure comprises a metal base body and a carbon composite layer, wherein the carbon composite layer is formed on the metal base body, and consists of metal granules and carbon granules through mutual sintering. When the heat dissipation structure of the invention is applied, the heat dissipation structure has the heat dissipation effects of the conventional vapor chamber and the heat spreader; and the heat dissipation structure comprises the carbon composite layer and a high heat-conducting metal plate which are attached to a heating electronic assembly for heat exchange so as to form a good heat dissipation effect.

Description

technical field [0001] The invention relates to a heat dissipation structure and a manufacturing method thereof, belonging to the field of heat dissipation technology and structure. More specifically, it relates to a heat dissipation structure and its manufacturing method which are applied to the heat generating place inside the electronic device to rapidly absorb heat energy and release heat energy. Background technique [0002] Among the components of electronic devices, there are many components that can generate high temperature and high heat, including central processing units, laser diodes, light-emitting diodes, microwave generators, etc., and with the improvement of computer performance, the power of these components will become more and more High, and its lines will become more and more dense, so that the heat generated by these components is getting higher and higher, and the heat is becoming more and more difficult to remove, so that the temperature of these compo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20F28D15/04F28F21/08F28F7/00F28F21/02B22F7/08
CPCF28D15/0233F28D15/046
Inventor 陈盈同陈伟恩
Owner 陈盈同
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