Low-density underwater sound absorbing plate and preparation method thereof

A low-density, plate-based technology, applied in chemical instruments and methods, sound-generating devices, synthetic resin layered products, etc., can solve the problems of large overall weight and limited use range of sandwich structures, and meet the requirements of structural load-bearing strength and stiffness, Improve the sound absorption effect and reduce the overall weight

Inactive Publication Date: 2010-06-02
NAVAL UNIV OF ENG PLA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned sandwich structure sound-absorbing core materials studied in the past, such as sound-absorbing rubber, must have a good underwater sound-absorbing effect without opening a cavity or foaming, and its relative density (relative to water) is very low. It is difficult to achieve less than 1, and the thickness is generally more than 50mm, which makes the overall weight of the sandwich structure larger and limits the scope of use of this structure

Method used

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  • Low-density underwater sound absorbing plate and preparation method thereof
  • Low-density underwater sound absorbing plate and preparation method thereof
  • Low-density underwater sound absorbing plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Upper component: matrix resin 200kg (of which: epoxy resin 6350 is 100kg, polyurethane modified epoxy resin is 100kg), filler 45kg (of which: hollow glass microsphere QH-700 is 15kg, hollow glass microsphere K-600 is 5kg, hollow glass microsphere K-180 is 5kg, muscovite is 20kg), curing agent 45kg (among them: 593 is 30kg, polyetheramine D2000 is 15kg), auxiliary agent 10kg (coupling agent KH550);

[0022] Lower component: matrix resin 450kg (of which: polyurethane is 200kg, polyurethane modified epoxy resin is 250kg), filler 115kg (of which: hollow glass microsphere QH-700 is 30kg, hollow glass microsphere K-600 is 20kg, hollow Glass microsphere K-800 is 20kg, hollow glass microsphere K-100 is 20kg, muscovite is 20kg, chopped fiber is 5kg), curing agent is 125kg (of which: 593 is 65kg, polyetheramine D2000 is 20kg, polyether Amine T5000 is 30kg, DMP-30 is 10kg), auxiliary agent is 10kg (coupling agent KH550). The aforementioned chopped fibers are cut from glass fiber ...

Embodiment 2

[0026] Upper component: matrix resin 170kg (polyurethane modified epoxy resin), filler 35kg (including: hollow glass microsphere QH-700 is 10kg, hollow glass microsphere K-180 is 15kg, muscovite is 10kg), curing agent 40kg (593), auxiliary agent 5kg (coupling agent KH550);

[0027] Lower layer components: matrix resin 450kg (epoxy resin 6350), filler 140kg (of which: hollow glass microsphere QH-700 is 60kg, hollow glass microsphere K-600 is 10kg, hollow glass microsphere K-180 is 40kg, Baiyun Motherboard is 30kg), curing agent 140kg (of which: 593 is 100kg, polyetheramine T5000 is 40kg), auxiliary agent 20kg (coupling agent KH550).

[0028] Weigh the base resin after dehydration according to the above ratio, add dry filler after surface treatment with coupling agent after preheating, then add auxiliary agent and curing agent, and use electric stirring and other dispersion techniques to make the filler in the base resin Fully disperse in the medium, trigger cross-linking and c...

Embodiment 3

[0030] Upper component: matrix resin 200kg (of which: epoxy resin 6350 is 100kg, polyurethane modified epoxy resin is 100kg), filler 45kg (of which: hollow glass microsphere QH-700 is 20kg, hollow glass microsphere K-180 is 5kg, hollow glass microsphere K-100 is 20kg), curing agent 45kg (of which: 593 is 30kg, polyetheramine T5000 is 15kg), auxiliary agent 10kg (coupling agent KH550);

[0031] Lower component: matrix resin 400kg (polyurethane modified epoxy resin), filler 150kg (of which: hollow glass microsphere K-600 is 30kg, hollow glass microsphere K-180 is 30kg, hollow glass microsphere K-800 is 50kg , muscovite is 40kg), curing agent 120kg (of which: 593 is 80kg, polyetheramine D2000 is 30kg, DMP-30 is 10kg), auxiliary agent 30kg (of which: coupling agent KH550 is 10kg, diluent 501 is 10kg, Dispersant BYK903 is 10kg).

[0032] Weigh the base resin after dehydration according to the above ratio, add dry filler after surface treatment with coupling agent after preheating,...

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Abstract

The invention relates to a low-density underwater sound absorbing plate mainly used for an underwater sandwich structure core and a preparation method thereof. The sound absorbing plate effectively absorbs sound and has relatively low density. The sound absorbing plate is molded by separately pouring and curing an upper layer and a lower layer, wherein the upper layer comprises the following raw materials in percentage by weight: 55-75 percent of matrix resin, 10-20 percent of filler, 10-30 percent of curing agent and 1-5 percent of auxiliary agent; the lower layer comprises the following raw materials in percentage by weight: 40-65 percent of matrix resin, 15-30 percent of filler, 15-40 percent of cutting agent and 1-5 percent of auxiliary agent; the fillers contain hollow glass beads with grain sizes of 10-800 micrometers; and the thickness ratio of the upper layer to the lower layer is 1:(3-5). The preparation method comprises the following steps of: dewatering the raw materials of the upper layer and the lower layer; respectively proportioning and weighing the raw materials according to a range of 0.75-0.8 of the relative density of the whole plate and the content of the components of the upper layer and the lower layer; preheating the matrix resin of the upper layer and the lower layer; adding the fillers and then adding the auxiliary agents and the curing agents so as to ensure that the fillers are sufficiently dispersed in the matrix resin; initiating crosslinking and carrying out vacuum-pumping treatment on the raw materials; and then pouring the raw materials into a mold by adopting a layered pouring and curing method that the upper layer is firstly poured and then the lower layer is poured.

Description

technical field [0001] The invention relates to an underwater sound-absorbing material, in particular to a low-density underwater sound-absorbing plate mainly used as a core material of an underwater sandwich structure and a preparation method thereof. Background technique [0002] Using high-strength fiber-reinforced composite materials with good sound transmission performance as the surface layer and polymer sound-absorbing materials as the core material, sandwich sandwich structure composite materials can be prepared. This composite material integrates load-bearing and sound-absorbing functions, and has vibration The advantages of good damping performance, non-magnetic characteristics, and easy molding will become an important direction for future research on sound absorption of underwater structures. It has been more than 30 years abroad that sandwich sandwich composite materials have been used in the research of underwater sound-absorbing structures. With the further m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G10K11/16B32B27/18
Inventor 梅志远李浩崔忠杰鲁程
Owner NAVAL UNIV OF ENG PLA
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