Manufacturing method of array substrate

Abstract

The invention provides a manufacturing method of an array substrate, which at least comprises the following steps: forming a plurality of metal blocks in a first region and a second region on a substrate; sequentially forming an insulating layer and a semiconductor layer on the substrate, and covering the insulating layer and the semiconductor layer on metal blocks; coating a first photoresist layer on the substrate, and covering the first photoresist layer on the semiconductor layer and the metal blocks below the semiconductor layer; forming a first photoresist pattern and a second photoresist pattern above the metal blocks by using a half-tone photomask; removing the second photoresist pattern and the semiconductor layer and the insulating layer below the second photoresist pattern for exposing the metal blocks in the second region; reserving the first photoresist pattern and removing the residual first photoresist layer; removing the exposed semiconductor layer which is not covered by the first photoresist pattern; and forming a source electrode and a drain electrode on the semiconductor layer in the first region.

Description

technical field [0001] The present invention relates to a manufacturing method of an array substrate, in particular, to a manufacturing method of an array substrate which can reduce the loss of the critical dimension of a contact window. Background technique [0002] With the advancement of science and technology, the liquid crystal display with many advantages such as power saving, no radiation, small size, low power consumption, flat right angle, high resolution, and stable picture quality is the traditional picture tube screen ( CRT for short) has brought a great impact, especially nowadays all kinds of information products such as: mobile phones, notebook computers, digital cameras, PDAs, LCD screens and other products are becoming more and more popular, which also makes the demand for liquid crystal displays (LCD) greatly increased. promote. [0003] The liquid crystal display mainly includes a liquid crystal display panel and a backlight module, wherein the liquid cry...

AI Technical Summary

Problems solved by technology

[0014] In order to manufacture an active array substrate, the above-mentioned manufacturing method requires four photomasks, so that the lead time of the manufacturing process (lead time) is lengthened, and because the flattening film at the bottom of the pixel electrode is exposed to the ashing reaction, there will be a large The film thickness loss, so the contact window will have a large critical dimension loss, and when making the contact hole, because the second metal layer is exposed after the development is completed in the lithography process of the flat layer, before covering the transparent conductive film If undergoing a dry etching process, the surface of the drain and source will be subjected to long-term plasma bombardment, which will easily cause surface defects of the drain and source (second metal layer), which will affect the second metal layer and the transparent conductive film. The contact resistance and adhesion are the factors that reduce the yield rate.

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