Method for enhancing interface properties of metal/epoxy resin composite material by using dendrimers
A technology of epoxy resin and composite materials, which is applied in the direction of surface coating liquid device, pretreatment surface, coating, etc., can solve the problems of poor stability of metal/epoxy resin composite materials, etc., and achieve unique rheological properties, The effect of enhancing interface performance and improving interface strength
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specific Embodiment approach 1
[0009] Specific embodiment one: the method for enhancing the interfacial properties of metal / epoxy resin composite materials in this embodiment is carried out according to the following steps: one, cleaning the substrate; two, mechanically processing the cleaned substrate; three, mechanically processing the The substrate is oxidized and dried in vacuum; 4. Cover the surface of the substrate treated in step 3 with 0.5 to 4th generation polyamide-amine (PAMAM) dendrimers by soaking, pulling or spin coating, and then React at 20-100°C for 0.5-12h; 5. Alternately wash the substrate treated in step 4 with deionized water and solvent, and then dry it under vacuum at 70-90°C to obtain a metal substrate; 6. Epoxy The resin cured body is coated on the surface of the metal substrate, and under the condition of a pressure of 0.3-0.6MPa, the temperature is raised to 60-80°C and kept for 1-2h, and then the temperature is raised to 120-150°C for 3-6h, and it is strengthened. post-metal / epox...
specific Embodiment approach 2
[0019] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the substrate in step 1 is made of aluminum or titanium. Other steps and parameters are the same as those in Embodiment 1.
specific Embodiment approach 3
[0020] Specific embodiment 3: The difference between this embodiment and specific embodiments 1 to 2 is that the method for cleaning the substrate in step 1 is to put the substrate into an organic solvent and process it for 5 to 30 minutes under the condition of an ultrasonic frequency of 0.5 to 100 kHz. , wherein the organic solvent is composed of one or more of acetone, methanol or ethyl acetate. Other steps and parameters are the same as those in Embodiments 1 to 2.
[0021] In this embodiment, the surface of the metal substrate is cleaned to remove pollutants on the surface of the substrate.
[0022] In this embodiment, when the organic solvents are a mixture, the organic solvents can be mixed in any ratio.
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